CRIS Current Research Information System

LOI, IGOR
 Distribuzione geografica
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Continente #
NA - Nord America 6.050
AS - Asia 3.170
EU - Europa 2.590
SA - Sud America 160
AF - Africa 123
OC - Oceania 4
Continente sconosciuto - Info sul continente non disponibili 1
Totale 12.098
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Nazione #
US - Stati Uniti d'America 5.899
VN - Vietnam 949
SG - Singapore 766
GB - Regno Unito 755
CN - Cina 682
IT - Italia 477
DE - Germania 374
HK - Hong Kong 370
SE - Svezia 260
FR - Francia 169
IN - India 148
RU - Federazione Russa 148
CA - Canada 138
BR - Brasile 115
IE - Irlanda 89
UA - Ucraina 78
JP - Giappone 57
ZA - Sudafrica 55
KR - Corea 51
EE - Estonia 48
CI - Costa d'Avorio 34
FI - Finlandia 28
BE - Belgio 27
NL - Olanda 25
CH - Svizzera 24
AR - Argentina 20
BG - Bulgaria 20
TR - Turchia 19
ID - Indonesia 17
TG - Togo 17
ES - Italia 16
PH - Filippine 16
JO - Giordania 14
EC - Ecuador 12
BD - Bangladesh 11
AT - Austria 10
TW - Taiwan 10
IQ - Iraq 9
MY - Malesia 9
PL - Polonia 9
GR - Grecia 8
MX - Messico 8
TH - Thailandia 7
RO - Romania 6
SA - Arabia Saudita 6
IL - Israele 5
LB - Libano 5
LT - Lituania 5
UZ - Uzbekistan 5
AU - Australia 4
CO - Colombia 4
IR - Iran 4
MA - Marocco 4
PK - Pakistan 4
PT - Portogallo 3
CL - Cile 2
DK - Danimarca 2
KE - Kenya 2
LV - Lettonia 2
MD - Moldavia 2
NP - Nepal 2
PE - Perù 2
SC - Seychelles 2
TN - Tunisia 2
VE - Venezuela 2
AO - Angola 1
BO - Bolivia 1
BY - Bielorussia 1
CZ - Repubblica Ceca 1
DZ - Algeria 1
EG - Egitto 1
EU - Europa 1
GD - Grenada 1
GH - Ghana 1
GM - Gambi 1
HR - Croazia 1
KZ - Kazakistan 1
NI - Nicaragua 1
PA - Panama 1
PS - Palestinian Territory 1
PY - Paraguay 1
RE - Reunion 1
RS - Serbia 1
SI - Slovenia 1
SV - El Salvador 1
TL - Timor Orientale 1
TT - Trinidad e Tobago 1
UG - Uganda 1
UY - Uruguay 1
YE - Yemen 1
Totale 12.098
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Città #
Ann Arbor 1.942
Southend 614
Singapore 532
Fairfield 468
Ashburn 426
Hong Kong 351
Wilmington 258
Woodbridge 247
Chandler 236
Seattle 217
Houston 178
Cambridge 172
San Jose 170
Santa Clara 164
Ho Chi Minh City 163
Dong Ket 161
Hanoi 151
Bologna 122
Montréal 118
Princeton 118
Munich 99
Beijing 92
Dublin 89
Mcallen 85
Los Angeles 77
Boardman 67
Turin 61
Nanjing 57
Westminster 54
Lauterbourg 53
Padova 50
Berlin 49
Hefei 46
Jinan 40
Seoul 40
Tokyo 39
Da Nang 36
Medford 36
Abidjan 34
Buffalo 34
Shenyang 34
Saint Petersburg 33
Jacksonville 29
Redmond 28
Milan 27
Dallas 25
San Diego 25
Florence 24
Helsinki 24
New York 24
Brussels 23
Redondo Beach 23
Dearborn 19
Sofia 19
Haiphong 18
Nanchang 18
Changsha 17
Council Bluffs 17
Falls Church 17
Lomé 17
London 17
Hebei 16
Norwalk 16
The Dalles 16
Tianjin 16
Phoenix 15
São Paulo 15
Washington 15
Guangzhou 14
Jiaxing 14
Amman 13
Nuremberg 13
Zurich 13
Chicago 12
Istanbul 12
Taiyuan 12
Zhengzhou 12
Haikou 11
Jakarta 11
Rome 11
Shanghai 11
Shenzhen 11
Orem 10
Falkenstein 9
Hangzhou 9
Mülheim 9
Bengaluru 8
Biên Hòa 8
Can Tho 8
Frankfurt am Main 8
Olalla 8
Quito 8
Taizhou 8
Yubileyny 8
Kunming 7
Paris 7
Quảng Ngãi 7
San Francisco 7
Stockholm 7
Taipei 7
Totale 8.846
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Nome #
Mr.Wolf: An Energy-Precision Scalable Parallel Ultra Low Power SoC for IoT Edge Processing 440
The Quest for Energy-Efficient I$ Design in Ultra-Low-Power Clustered Many-Cores 435
A -1.8V to 0.9V body bias, 60 GOPS/W 4-core cluster in low-power 28nm UTBB FD-SOI technology 379
A 60 GOPS/W, -1.8 v to 0.9 v body bias ULP cluster in 28 nm UTBB FD-SOI technology 345
4.4 A 1.3TOPS/W @ 32GOPS Fully Integrated 10-Core SoC for IoT End-Nodes with 1.7μW Cognitive Wake-Up from MRAM-Based State-Retentive Sleep Mode 336
PULP: A parallel ultra low power platform for next generation IoT applications 325
An IoT Endpoint System-on-Chip for Secure and Energy-Efficient Near-Sensor Analytics 292
A Heterogeneous Multi-Core System-on-Chip for Energy Efficient Brain Inspired Computing 290
Logic-Base Interconnect Design for Near Memory Computing in the Smart Memory Cube 277
193 MOPS/mW @ 162 MOPS, 0.32V to 1.15V voltage range multi-core accelerator for energy efficient parallel and sequential digital processing 268
A case for three-dimensional stacking of tightly coupled data memories over multi-core clusters using low-latency interconnects 266
Design and evaluation of a processing-in-memory architecture for the smart memory cube 256
GAP-8: A RISC-V SoC for AI at the Edge of the IoT 256
Near-Threshold RISC-V Core With DSP Extensions for Scalable IoT Endpoint Devices 248
A heterogeneous multi-core system-on-chip for energy efficient brain inspired vision 248
Neurostream: Scalable and Energy Efficient Deep Learning with Smart Memory Cubes 238
A Modular Shared L2 Memory Design for 3-D Integration 237
A Hybrid Instruction Prefetching Mechanism for Ultra Low-Power Multicore Clusters 231
A resilient architecture for low latency communication in shared-L1 processor clusters 227
3D logarithmic interconnect: Stacking multiple L1 memory dies over multi-core clusters2013 Seventh IEEE/ACM International Symposium on Networks-on-Chip (NoCS) 227
3D-LIN: A Configurable Low-Latency Interconnect for Multi-Core Clusters with 3D Stacked L1 Memory 226
Energy-Efficient Near-Threshold Parallel Computing: The PULPv2 Cluster 225
Design Issues and Considerations for Low-Cost 3-D TSV IC Technology 218
A fully-synthesizable single-cycle interconnection network for Shared-L1 processor clusters 217
Curbing the roofline: a scalable and flexible architecture for CNNs on FPGA 215
Energy efficient parallel computing on the PULP platform with support for OpenMP 214
Area and Power Modeling for Networks-on-Chip with Layout Awareness 206
A new physical routing approach for robust bundled signaling on NoC links 206
A Self-Aware Architecture for PVT Compensation and Power Nap in Near Threshold Processors 205
Characterization and Implementation of Fault-Tolerant Vertical Links for 3-D Networks-on-Chip 205
Mr. Wolf: A 1 GFLOP/s Energy-Proportional Parallel Ultra Low Power SoC for IOT Edge Processing 204
Ultra-Low-Power Digital Architectures for the Internet of Things 198
A high-performance multiported L2 memory IP for scalable three-dimensional integration2013 IEEE International 3D Systems Integration Conference (3DIC) 193
Variation-Tolerant Architecture for Ultra Low Power Shared-L1 Processor Clusters 192
A shared-FPU architecture for ultra-low power MPSoCs, Proceedings of the ACM International Conference on Computing Frontiers - CF '13 190
A low-overhead fault tolerance scheme for TSV-based 3D network on chip links. 188
High Performance AXI-4.0 Based Interconnect for Extensible Smart Memory Cubes 187
Developing Mesochronous Synchronizers to Enable 3D NoCs 186
On-the-fly adaptivity for process networks over shared-memory platforms 186
Energy-efficient vision on the PULP platform for ultra-low power parallel computing 186
Sub-mW multi-Gbps chip-to-chip communication Links for Ultra-Low Power IoT end-nodes 180
Synthesis of low-overhead configurable source routing tables for network interfaces 179
PULP: A Ultra-Low Power Parallel Accelerator for Energy-Efficient and Flexible Embedded Vision 175
Design space exploration for 3D-stacked DRAMs 165
Ultra-low-latency lightweight dma for tightly coupled multi-core clusters 164
Exploring multi-banked shared-l1 program cache on ultra-low power, tightly coupled processor clusters 162
An energy efficient DRAM subsystem for 3D integrated SoCs 159
3D NoCs — Unifying inter & intra chip communication 159
Supporting vertical links for 3D networks on chip: toward an automated design and analysis flow 158
An efficient distributed memory interface for many-core platform with 3D stacked DRAM 157
A multi banked - Multi ported - Non blocking shared L2 cache for MPSoC platforms 156
Configurable Low-Latency Interconnect for Multi-core ClustersVLSI-SoC: From Algorithms to Circuits and System-on-Chip Design 153
Power/performance exploration of single-core and multi-core processor approaches for biomedical signal processing 152
Online process transformation for polyhedral process networks in shared-memory MPSoCs 143
Exploration and Optimization of 3-D Integrated DRAM Subsystems 137
Totale 12.267
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Categoria #
all - tutte 27.116
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 27.116
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Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2020/2021326 0 0 0 0 0 0 0 0 0 0 63 263
2021/20223.178 284 36 351 303 402 313 306 305 319 105 239 215
2022/20231.156 119 199 81 115 56 82 39 55 187 28 115 80
2023/2024269 25 54 32 8 29 57 6 10 6 24 13 5
2024/20251.114 44 189 111 80 232 66 90 35 19 31 44 173
2025/20262.783 162 151 252 130 348 191 762 79 503 187 18 0
Totale 12.267