TALLARICO, ANDREA NATALE

TALLARICO, ANDREA NATALE  

DIPARTIMENTO DI INGEGNERIA DELL'ENERGIA ELETTRICA E DELL'INFORMAZIONE "GUGLIELMO MARCONI"  

Docenti di ruolo di IIa fascia  

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Risultati 1 - 20 di 43 (tempo di esecuzione: 0.031 secondi).
Titolo Autore(i) Anno Periodico Editore Tipo File
Analysis of RTN Induced by Forward Gate Stress in GaN HEMTs with a Schottky p-GaN Gate Millesimo M.; Fiegna C.; Bakeroot B.; Borga M.; Posthuma N.; Decoutere S.; Sangiorgi E.; Tallaric...o A.N. 2024-01-01 - Institute of Electrical and Electronics Engineers Inc. 4.01 Contributo in Atti di convegno -
GaN HEMT with p-Type Schottky Gate: A Case Study of TCAD Modeling of the Gate Leakage Current Ercolano F.; Tallarico A.N.; Millesimo M.; Gnani E.; Reggiani S.; Fiegna C.; Borga M.; Posthuma N....; Bakeroot B. 2024-01-01 - Springer Science and Business Media Deutschland GmbH 4.01 Contributo in Atti di convegno -
P-GaN Gate HEMTs: A Solution to Improve the High-Temperature Gate Lifetime Tallarico A.N.; Millesimo M.; Borga M.; Bakeroot B.; Posthuma N.; Cosnier T.; Decoutere S.; Sangi...orgi E.; Fiegna C. 2024-01-01 IEEE ELECTRON DEVICE LETTERS - 1.01 Articolo in rivista P-GaN_Gate_HEMTs_A_Solution_to_Improve_the_High-Temperature_Gate_Lifetime.pdf
Positive Bias Temperature Instability in SiC-Based Power MOSFETs Volosov V.; Bevilacqua S.; Anoldo L.; Tosto G.; Fontana E.; Russo A.-L.; Fiegna C.; Sangiorgi E.;... Tallarico A.N. 2024-01-01 MICROMACHINES - 1.01 Articolo in rivista -
In-Circuit Assessment of the Long-Term Reliability of E-Mode GaN HEMTs Capasso G.; Zanuccoli M.; Tallarico A.N.; Fiegna C. 2023-01-01 IEEE TRANSACTIONS ON ELECTRON DEVICES - 1.01 Articolo in rivista In-Circuit_Assessment_of_the_Long-Term_Reliability_of_E-Mode_GaN_HEMTs.pdf
Role of interface/border traps on the threshold voltage instability of SiC power transistors Volosov V.; Cascino S.; Saggio M.; Imbruglia A.; Di Giovanni F.; Fiegna C.; Sangiorgi E.; Tallari...co A.N. 2023-01-01 SOLID-STATE ELECTRONICS - 1.01 Articolo in rivista post_print_INFOS_SSE.pdf
Role of the GaN-on-Si Epi-Stack on Δ RONCaused by Back-Gating Stress Millesimo M.; Borga M.; Valentini L.; Bakeroot B.; Posthuma N.; Vohra A.; Decoutere S.; Fiegna C....; Tallarico A.N. 2023-01-01 IEEE TRANSACTIONS ON ELECTRON DEVICES - 1.01 Articolo in rivista Role_of_the_GaN-on-Si_Epi-Stack_on_RON_Caused_by_Back-Gating_Stress (1).pdf
SiC MOSFETs performance modeling in Simulink Simscape environment Ferretti, Jacopo; Schiapparelli, Giacomo-Piero; Sangiorgi, Enrico; Tallarico, Andrea Natale 2023-01-01 - IEEE 4.01 Contributo in Atti di convegno -
A novel approach to analyze the reliability of GaN power HEMTs operating in a DC-DC Buck converter Capasso G.; Zanuccoli M.; Tallarico A.N.; Fiegna C. 2022-01-01 - Editions Frontieres 4.01 Contributo in Atti di convegno -
Gate Reliability of p-GaN Power HEMTs Under Pulsed Stress Condition Millesimo M.; Bakeroot B.; Borga M.; Posthuma N.; Decoutere S.; Sangiorgi E.; Fiegna C.; Tallaric...o A.N. 2022-01-01 - Institute of Electrical and Electronics Engineers Inc. 4.01 Contributo in Atti di convegno -
TCAD Modeling of the Dynamic VTH Hysteresis Under Fast Sweeping Characterization in p-GaN Gate HEMTs Tallarico A.N.; Millesimo M.; Bakeroot B.; Borga M.; Posthuma N.; Decoutere S.; Sangiorgi E.; Fie...gna C. 2022-01-01 IEEE TRANSACTIONS ON ELECTRON DEVICES - 1.01 Articolo in rivista Post_print_version.pdf
The Role of Frequency and Duty Cycle on the Gate Reliability of p-GaN HEMTs Millesimo M.; Borga M.; Bakeroot B.; Posthuma N.; Decoutere S.; Sangiorgi E.; Fiegna C.; Tallaric...o A.N. 2022-01-01 IEEE ELECTRON DEVICE LETTERS - 1.01 Articolo in rivista The_Role_of_Frequency_and_Duty_Cycle_on_the_Gate_Reliability_of_p-GaN_HEMTs.pdfThe_Role_of_Frequency_and_Duty_Cycle_on_the_Gate_Reliability_postprint.pdf
High-Temperature Time-Dependent Gate Breakdown of p-GaN HEMTs Millesimo M.; Fiegna C.; Posthuma N.; Borga M.; Bakeroot B.; Decoutere S.; Tallarico A.N. 2021-01-01 IEEE TRANSACTIONS ON ELECTRON DEVICES - 1.01 Articolo in rivista Final_Manuscript_merged.pdf
Impact of structural and process variations on the time-dependent off-state breakdown of p-gan power hemts Millesimo M.; Posthuma N.; Bakeroot B.; Borga M.; Decoutere S.; Tallarico A.N. 2021-01-01 IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY - 1.01 Articolo in rivista Post_print_version.pdf
Understanding the impact of split-gate LDMOS transistors: Analysis of performance and hot-carrier-induced degradation Magnone, P.; Tallarico, A.N.; Pistollato, S.; Depetro, R.; Croce, G. 2021-01-01 SOLID-STATE ELECTRONICS - 1.01 Articolo in rivista Post_print_merged.pdf
Full Understanding of Hot Electrons and Hot/Cold Holes in the Degradation of p-channel Power LDMOS Transistors Tallarico A.N.; Reggiani S.; Depetro R.; Croce G.; Sangiorgi E.; Fiegna C. 2020-01-01 - Institute of Electrical and Electronics Engineers Inc. 4.01 Contributo in Atti di convegno 09129112.pdfpost-print.pdf
Role of the AlGaN barrier on the long-term gate reliability of power HEMTs with p-GaN gate Tallarico A.N.; Posthuma N.E.; Bakeroot B.; Decoutere S.; Sangiorgi E.; Fiegna C. 2020-01-01 MICROELECTRONICS RELIABILITY - 1.01 Articolo in rivista role of the AlGaN post print.pdf
TCAD simulation of hot-carrier stress degradation in split-gate n-channel STI-LDMOS transistors Giuliano F.; Magnone P.; Pistollato S.; Tallarico A.N.; Reggiani S.; Fiegna C.; Depetro R.; Rosse...tti M.; Croce G. 2020-01-01 MICROELECTRONICS RELIABILITY - 1.01 Articolo in rivista TCAD simulation POST PRINT.pdf
An integrated DC/DC converter with online monitoring of hot-carrier degradation Pizzotti M.; Crescentini M.; Tallarico A.N.; Romani A. 2019-01-01 - Institute of Electrical and Electronics Engineers Inc. 4.01 Contributo in Atti di convegno R2Power300_icecs2019_maybefinal shortref.pdf
Characterization and Modeling of BTI in SiC MOSFETs Cornigli D.; Tallarico A.N.; Reggiani S.; Fiegna C.; Sangiorgi E.; Sanchez L.; Valdivieso C.; Con...sentino G.; Crupi F. 2019-01-01 - Editions Frontieres 4.01 Contributo in Atti di convegno 08901761 (1).pdfcombinepdfESSDERC2019.pdf