Diamond-like carbon (DLC) is a very attractive material for Microelectronics, as it can be used to create robust passivation layers in semiconductor devices. In this work, the modelling of DLC in a TCAD framework is addressed, with special attention to the role played as the bevel coating of large-Area high-voltage diodes. The TCAD simulations are nicely compared with experiments, giving rise to a detailed explanation of the role played by the DLC conductivity on the diode performance.

Numerical investigation of the leakage current and blocking capabilities of high-power diodes with doped dlc passivation layers / Balestra L.; Reggiani S.; Gnudi A.; Gnani E.; Baccarani G.; Dobrzynska J.; Vobecky J.. - ELETTRONICO. - 2019-:(2019), pp. 8870354.1-8870354.4. (Intervento presentato al convegno 24th International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2019 tenutosi a Palazzo di Toppo Wassermann, ita nel 2019) [10.1109/SISPAD.2019.8870354].

Numerical investigation of the leakage current and blocking capabilities of high-power diodes with doped dlc passivation layers

Balestra L.
;
Reggiani S.;Gnudi A.;Gnani E.;Baccarani G.;
2019

Abstract

Diamond-like carbon (DLC) is a very attractive material for Microelectronics, as it can be used to create robust passivation layers in semiconductor devices. In this work, the modelling of DLC in a TCAD framework is addressed, with special attention to the role played as the bevel coating of large-Area high-voltage diodes. The TCAD simulations are nicely compared with experiments, giving rise to a detailed explanation of the role played by the DLC conductivity on the diode performance.
2019
International Conference on Simulation of Semiconductor Processes and Devices, SISPAD
1
4
Numerical investigation of the leakage current and blocking capabilities of high-power diodes with doped dlc passivation layers / Balestra L.; Reggiani S.; Gnudi A.; Gnani E.; Baccarani G.; Dobrzynska J.; Vobecky J.. - ELETTRONICO. - 2019-:(2019), pp. 8870354.1-8870354.4. (Intervento presentato al convegno 24th International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2019 tenutosi a Palazzo di Toppo Wassermann, ita nel 2019) [10.1109/SISPAD.2019.8870354].
Balestra L.; Reggiani S.; Gnudi A.; Gnani E.; Baccarani G.; Dobrzynska J.; Vobecky J.
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11585/728350
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