FAZZI, ALBERTO
 Distribuzione geografica
Continente #
NA - Nord America 979
EU - Europa 502
AS - Asia 307
AF - Africa 62
SA - Sud America 2
OC - Oceania 1
Totale 1.853
Nazione #
US - Stati Uniti d'America 975
VN - Vietnam 181
GB - Regno Unito 134
DE - Germania 71
SE - Svezia 65
CN - Cina 64
IT - Italia 58
UA - Ucraina 54
FR - Francia 30
TG - Togo 30
IN - India 28
IE - Irlanda 19
RU - Federazione Russa 19
SG - Singapore 13
BG - Bulgaria 12
FI - Finlandia 11
JO - Giordania 11
NG - Nigeria 11
CI - Costa d'Avorio 10
GR - Grecia 10
BE - Belgio 8
EE - Estonia 8
ZA - Sudafrica 6
SC - Seychelles 5
CA - Canada 3
CL - Cile 2
IR - Iran 2
JP - Giappone 2
KZ - Kazakistan 2
AE - Emirati Arabi Uniti 1
AU - Australia 1
CH - Svizzera 1
DO - Repubblica Dominicana 1
IL - Israele 1
KR - Corea 1
NL - Olanda 1
PT - Portogallo 1
TR - Turchia 1
Totale 1.853
Città #
Ann Arbor 395
Dong Ket 149
Southend 115
Chandler 87
Fairfield 70
Ashburn 41
Jacksonville 41
Seattle 38
Wilmington 37
Woodbridge 37
Cambridge 36
Lomé 30
Houston 29
Princeton 22
Dublin 19
Bologna 16
Sofia 12
Westminster 12
Abeokuta 11
Amman 11
Helsinki 11
Padova 11
Singapore 11
Turin 11
Abidjan 10
Braunschweig 10
Hebei 9
Brussels 8
Medford 8
Nanjing 8
Berlin 7
Jinan 7
San Diego 7
Des Moines 6
Milan 6
Pune 6
Bremen 5
Mahé 5
Mülheim 5
Nanchang 5
Shenyang 5
Beijing 4
Jiaxing 4
Paris 4
Saint Petersburg 4
Kunming 3
Zhengzhou 3
Almaty 2
Boardman 2
Bühl 2
Changsha 2
Grafing 2
Lanzhou 2
Ningbo 2
Novokuznetsk 2
Taizhou 2
Tokyo 2
Verona 2
Athens 1
Bern 1
Dearborn 1
Den Haag 1
Frankfurt Am Main 1
Genzano Di Roma 1
Guiyang 1
Haifa 1
Hangzhou 1
La Canada Flintridge 1
Las Vegas 1
Leawood 1
Leipzig 1
Markham 1
Mehr 1
Moscow 1
Newark 1
North York 1
Norwalk 1
Nuremberg 1
Olalla 1
Olinda 1
Providence 1
San Francisco 1
Shanghai 1
Taiyuan 1
Toronto 1
Udine 1
Zanjan 1
Zhongxin 1
Totale 1.443
Nome #
A 0.14mW/Gbps High-Density Capacitive Interface for 3D System Integration 246
3D Capacitive Interconnections for High Speed Interchip Communication 196
3-D Capacitive Interconnections for Wafer-Level and Die-Level Assembly 177
3D Contactless communication for IC design 171
Chip-to-chip interconnections based on the wireless capacitive coupling for 3D integration 167
3-D Capacitive Interconnections With Mono- and Bi-Directional Capabilities 164
3D Capacitive Interconnections with Mono- and Bi-Directional Capabilities 164
3D Technology based on aligned wafer-towafer direct bonding for capacitive coupling interconnectivity 161
Electrical Measurement of alignment for 3D stacked chips 156
3D Integration for Hybrid Integration of Integrated Circuits 149
Yield Prediction for 3D Capacitive Interconnections 124
Totale 1.875
Categoria #
all - tutte 3.402
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 3.402


Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2019/2020305 0 5 8 25 28 46 43 53 37 26 12 22
2020/2021212 37 17 2 12 5 9 10 13 24 12 8 63
2021/2022744 142 6 71 71 75 60 64 55 68 26 50 56
2022/2023328 33 63 22 40 29 31 7 15 55 1 27 5
2023/202479 10 11 8 5 7 20 2 2 2 11 0 1
2024/202513 13 0 0 0 0 0 0 0 0 0 0 0
Totale 1.875