statistiche ricercatore

Continente	#
NA - Nord America	1.194
AS - Asia	801
EU - Europa	598
AF - Africa	77
SA - Sud America	21
Continente sconosciuto - Info sul continente non disponibili	2
OC - Oceania	1
Totale	2.694

Nazione	#
US - Stati Uniti d'America	1.186
VN - Vietnam	295
CN - Cina	181
SG - Singapore	173
GB - Regno Unito	139
DE - Germania	82
SE - Svezia	66
IT - Italia	61
UA - Ucraina	54
FR - Francia	42
HK - Hong Kong	42
NL - Olanda	37
IN - India	33
TG - Togo	30
RU - Federazione Russa	28
KR - Corea	25
FI - Finlandia	21
IE - Irlanda	19
CI - Costa d'Avorio	17
JP - Giappone	14
BR - Brasile	13
BG - Bulgaria	12
GR - Grecia	11
JO - Giordania	11
NG - Nigeria	11
ZA - Sudafrica	10
BE - Belgio	9
EE - Estonia	8
SC - Seychelles	8
PH - Filippine	7
CA - Canada	5
AR - Argentina	3
CL - Cile	3
IL - Israele	3
AE - Emirati Arabi Uniti	2
ES - Italia	2
IR - Iran	2
KZ - Kazakistan	2
LT - Lituania	2
SA - Arabia Saudita	2
TW - Taiwan	2
AT - Austria	1
AU - Australia	1
BD - Bangladesh	1
BY - Bielorussia	1
CH - Svizzera	1
CO - Colombia	1
CR - Costa Rica	1
CW - ???statistics.table.value.countryCode.CW???	1
DO - Repubblica Dominicana	1
EG - Egitto	1
IQ - Iraq	1
KH - Cambogia	1
MX - Messico	1
MY - Malesia	1
PK - Pakistan	1
PL - Polonia	1
PT - Portogallo	1
PY - Paraguay	1
TH - Thailandia	1
TR - Turchia	1
XK - ???statistics.table.value.countryCode.XK???	1
Totale	2.694

Nome	#
A 0.14mW/Gbps High-Density Capacitive Interface for 3D System Integration	385
3D Capacitive Interconnections for High Speed Interchip Communication	270
3D Contactless communication for IC design	246
3D Technology based on aligned wafer-towafer direct bonding for capacitive coupling interconnectivity	243
Electrical Measurement of alignment for 3D stacked chips	241
3-D Capacitive Interconnections With Mono- and Bi-Directional Capabilities	236
3-D Capacitive Interconnections for Wafer-Level and Die-Level Assembly	235
3D Capacitive Interconnections with Mono- and Bi-Directional Capabilities	229
Chip-to-chip interconnections based on the wireless capacitive coupling for 3D integration	223
3D Integration for Hybrid Integration of Integrated Circuits	217
Yield Prediction for 3D Capacitive Interconnections	191
Totale	2.716

	Totale	Lug	Ago	Sett	Ott	Nov	Dic	Gen	Feb	Mar	Apr	Mag	Giu
2020/2021	71	0	0	0	0	0	0	0	0	0	0	8	63
2021/2022	744	142	6	71	71	75	60	64	55	68	26	50	56
2022/2023	328	33	63	22	40	29	31	7	15	55	1	27	5
2023/2024	79	10	11	8	5	7	20	2	2	2	11	0	1
2024/2025	302	13	36	24	15	55	19	7	12	4	34	17	66
2025/2026	552	43	51	55	46	71	46	54	27	114	40	5	0
Totale													2.716

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