statistiche ricercatore

Continente	#
NA - Nord America	1.255
AS - Asia	805
EU - Europa	600
AF - Africa	77
SA - Sud America	26
Continente sconosciuto - Info sul continente non disponibili	24
OC - Oceania	1
Totale	2.788

Nazione	#
US - Stati Uniti d'America	1.246
VN - Vietnam	295
CN - Cina	183
SG - Singapore	173
GB - Regno Unito	139
DE - Germania	82
SE - Svezia	66
IT - Italia	61
UA - Ucraina	54
HK - Hong Kong	43
FR - Francia	42
NL - Olanda	38
IN - India	33
TG - Togo	30
RU - Federazione Russa	28
KR - Corea	25
FI - Finlandia	21
IE - Irlanda	19
CI - Costa d'Avorio	17
JP - Giappone	14
BR - Brasile	13
BG - Bulgaria	12
GR - Grecia	11
JO - Giordania	11
NG - Nigeria	11
ZA - Sudafrica	10
BE - Belgio	9
EE - Estonia	8
SC - Seychelles	8
PH - Filippine	7
CA - Canada	5
AR - Argentina	4
CL - Cile	3
IL - Israele	3
AE - Emirati Arabi Uniti	2
BD - Bangladesh	2
CO - Colombia	2
EC - Ecuador	2
ES - Italia	2
IR - Iran	2
KZ - Kazakistan	2
LT - Lituania	2
SA - Arabia Saudita	2
TW - Taiwan	2
AT - Austria	1
AU - Australia	1
BY - Bielorussia	1
CH - Svizzera	1
CR - Costa Rica	1
CW - ???statistics.table.value.countryCode.CW???	1
DO - Repubblica Dominicana	1
EG - Egitto	1
IQ - Iraq	1
KH - Cambogia	1
MX - Messico	1
MY - Malesia	1
NO - Norvegia	1
PA - Panama	1
PK - Pakistan	1
PL - Polonia	1
PT - Portogallo	1
PY - Paraguay	1
TH - Thailandia	1
TR - Turchia	1
VE - Venezuela	1
XK - ???statistics.table.value.countryCode.XK???	1
Totale	2.766

Nome	#
A 0.14mW/Gbps High-Density Capacitive Interface for 3D System Integration	396
3D Capacitive Interconnections for High Speed Interchip Communication	281
3D Contactless communication for IC design	252
3D Technology based on aligned wafer-towafer direct bonding for capacitive coupling interconnectivity	251
Electrical Measurement of alignment for 3D stacked chips	246
3-D Capacitive Interconnections for Wafer-Level and Die-Level Assembly	240
3-D Capacitive Interconnections With Mono- and Bi-Directional Capabilities	239
3D Capacitive Interconnections with Mono- and Bi-Directional Capabilities	234
Chip-to-chip interconnections based on the wireless capacitive coupling for 3D integration	231
3D Integration for Hybrid Integration of Integrated Circuits	224
Yield Prediction for 3D Capacitive Interconnections	194
Totale	2.788

	Totale	Lug	Ago	Sett	Ott	Nov	Dic	Gen	Feb	Mar	Apr	Mag	Giu
2021/2022	596	0	0	71	71	75	60	64	55	68	26	50	56
2022/2023	328	33	63	22	40	29	31	7	15	55	1	27	5
2023/2024	79	10	11	8	5	7	20	2	2	2	11	0	1
2024/2025	302	13	36	24	15	55	19	7	12	4	34	17	66
2025/2026	589	43	51	55	46	71	46	54	27	114	40	11	31
2026/2027	35	5	12	18	0	0	0	0	0	0	0	0	0
Totale													2.788

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