3D contactless technology based on capacitive coupling represents a promising solution for high-speed and low power signaling in vertically integrated chips. AC coupled interconnects do not suffer from mechanical stress, and the parasitic load is much reduced when compared to standard DC solutions, such as wire bonding and micro bumps. Communication system based on wireless interconnection scheme with transmitter and receiver circuits implemented in 0.13mum CMOS technology and connected to 8x8mum2 electrodes in the upper metal layer of different dies and with face-to-face assembly, makes available a throughput of more than 22Mbps/mum2 with 80muW/Gbps energy consumption.
3D Contactless communication for IC design / R. Canegallo; L. Ciccarelli; F. Natali; A. Fazzi; R. Guerrieri; P. Rolandi. - STAMPA. - (2008), pp. 241-244. (Intervento presentato al convegno IEEE International Conference on Integrated Circuit Design and Technology tenutosi a Austin, TX nel 2-4 June 2008) [10.1109/ICICDT.2008.4567286].
3D Contactless communication for IC design
CANEGALLO, ROBERTO;CICCARELLI, LUCA;NATALI, FEDERICO;FAZZI, ALBERTO;GUERRIERI, ROBERTO;
2008
Abstract
3D contactless technology based on capacitive coupling represents a promising solution for high-speed and low power signaling in vertically integrated chips. AC coupled interconnects do not suffer from mechanical stress, and the parasitic load is much reduced when compared to standard DC solutions, such as wire bonding and micro bumps. Communication system based on wireless interconnection scheme with transmitter and receiver circuits implemented in 0.13mum CMOS technology and connected to 8x8mum2 electrodes in the upper metal layer of different dies and with face-to-face assembly, makes available a throughput of more than 22Mbps/mum2 with 80muW/Gbps energy consumption.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
