CANEGALLO, ROBERTO
CANEGALLO, ROBERTO
DIP. DI ELETTRONICA,INFORMATICA,SISTEMISTICA-DEIS
3-D Capacitive Interconnections for Wafer-Level and Die-Level Assembly
2007-01-01 A.Fazzi; L.Magagni; M.Mirandola; B.Charlet; L.Di Cioccio; E.Jung; R.Canegallo; R.Guerrieri
3-D Capacitive Interconnections With Mono- and Bi-Directional Capabilities
2008-01-01 A.Fazzi; R.Canegallo; L.Ciccarelli; L.Magagni; F.Natali; E.Jung; P.Rolandi; R.Guerrieri
3D Capacitive Interconnections for High Speed Interchip Communication
2007-01-01 R. Canegallo; A. Fazzi; L. Ciccarelli; L. Magagni; F. Natali; P. L. Rolandi; E. Jung; L. Di Cioccio; R. Guerrieri
3D Capacitive Interconnections with Mono- and Bi-Directional Capabilities
2007-01-01 A.Fazzi; R.Canegallo; L.Ciccarelli; L.Magagni; F.Natali; E.Jung; P.L.Rolandi; R.Guerrieri
3D Capacitive transmission of analog signals with automatic compensation of the voltage attenuation
2009-01-01 E. Franchi Scarselli; F. Natali; A. Gnudi; M. Innocenti; L. Ciccarelli; M. Scandiuzzo; R. Canegallo; R. Guerrieri
3D Contactless communication for IC design
2008-01-01 R. Canegallo; L. Ciccarelli; F. Natali; A. Fazzi; R. Guerrieri; P. Rolandi
3D Integration for Hybrid Integration of Integrated Circuits
2006-01-01 E. Jung; S. Schmitz; K. Kaschlun; L. Magagni; A. Fazzi; R. Guerrieri; R. Canegallo
3D Technology based on aligned wafer-towafer direct bonding for capacitive coupling interconnectivity
2005-01-01 B.Charlet; L.Di Cioccio; J.Dechamp; M.Zussy; T.Enot; R.Canegallo; A.Fazzi; R.Guerrieri
A 0.14mW/Gbps High-Density Capacitive Interface for 3D System Integration
2005-01-01 A.Fazzi; L.Magagni; M.Mirandola; R.Canegallo ; S.Schmitz; R.Guerrieri
A CMOS based architecture for a distributed sensor matrix in underwater environment
2005-01-01 L. Magagni; M. Sergio; M. Nicolini; D. Gennaretti; R. Canegallo ; R. Guerrieri
A Fully Programmable eFPGA-Augmented SoC for Smart Power Applications
2020-01-01 Renzini, Francesco; Mucci, Claudio; Rossi, Davide; Franchi Scarselli, Eleonora; Canegallo, Roberto
A Low-Power System-on-Chip for the Documentation of Road Accidents
2005-01-01 Bolcioni L. ; Campi F. ; Canegallo R. ; Guerrieri R.
A Smart Node Architecture for Underwater Monitoring of Sensor Networks
2005-01-01 L. Magagni; M. Sergio; M. Nicolini; D. Gennaretti; R. Canegallo ; R. Guerrieri
A Textile Based CapacitivePressure Sensor
2004-01-01 M. Sergio; D. Gennaretti; M. Nicolini; N. Manaresi; M. Tartagni; R. Canegallo; R. Guerrieri
A XiRisc-based SoC for Embedded DSP for Embedded DSP Applications
2004-01-01 M. Bocchi; C. De Bartolomeis; C. Mucci; F. Campi; A. Lodi; M. Toma; R. Canegallo; R. Guerrieri
BEE-DRONES: Energy-efficient Data Collection on Wake-Up Radio-based Wireless Sensor Networks
2019-01-01 Trotta A.; Di Felice M.; Bononi L.; Natalizio E.; Perilli L.; Scarselli E.F.; Cinotti T.S.; Canegallo R.
Characterization and Programming Algorithm of Phase Change Memory Cells for Analog In-Memory Computing
2021-01-01 Antolini, Alessio; Franchi Scarselli, Eleonora; Gnudi, Antonio; Carissimi, Marcella; Pasotti, Marco; Romele, Paolo; Canegallo, Roberto
Chip-to-chip communication based on capacitive coupling
2009-01-01 R. Cardu; M. Scandiuzzo; S. Cani; L. Perugini; E. Franchi Scarselli; R. Canegallo; R. Guerrieri
Chip-to-chip interconnections based on the wireless capacitive coupling for 3D integration
2006-01-01 B. Charlet; L. Di Cioccio; J. Dechamp; M.Zussy; T. Enot; R. Canegallo; A. Fazzi; R. Guerrieri; L. Magagni
Dual-mode wake-up nodes for IoT monitoring applications: Measurements and algorithms
2018-01-01 Bedogni, Luca; Bononi, Luciano; Canegallo, Roberto; Carbone, Fabio; Di Felice, Marco; Scarselli, Eleonora Franchi; Montori, Federico; Perilli, Luca; Cinotti, Tullio Salmon; Trotta, Angelo
| Titolo | Autore(i) | Anno | Periodico | Editore | Tipo | File |
|---|---|---|---|---|---|---|
| 3-D Capacitive Interconnections for Wafer-Level and Die-Level Assembly | A.Fazzi; L.Magagni; M.Mirandola; B.Charlet; L.Di Cioccio; E.Jung; R.Canegallo; R.Guerrieri | 2007-01-01 | IEEE JOURNAL OF SOLID-STATE CIRCUITS | - | 1.01 Articolo in rivista | - |
| 3-D Capacitive Interconnections With Mono- and Bi-Directional Capabilities | A.Fazzi; R.Canegallo; L.Ciccarelli; L.Magagni; F.Natali; E.Jung; P.Rolandi; R.Guerrieri | 2008-01-01 | IEEE JOURNAL OF SOLID-STATE CIRCUITS | - | 1.01 Articolo in rivista | - |
| 3D Capacitive Interconnections for High Speed Interchip Communication | R. Canegallo; A. Fazzi; L. Ciccarelli; L. Magagni; F. Natali; P. L. Rolandi; E. Jung; L. Di Cioccio; R. Guerrieri | 2007-01-01 | - | IEEE | 4.01 Contributo in Atti di convegno | - |
| 3D Capacitive Interconnections with Mono- and Bi-Directional Capabilities | A.Fazzi; R.Canegallo; L.Ciccarelli; L.Magagni; F.Natali; E.Jung; P.L.Rolandi; R.Guerrieri | 2007-01-01 | - | s.n | 4.01 Contributo in Atti di convegno | - |
| 3D Capacitive transmission of analog signals with automatic compensation of the voltage attenuation | E. Franchi Scarselli; F. Natali; A. Gnudi; M. Innocenti; L. Ciccarelli; M. Scandiuzzo; R. Canegallo; R. Guerrieri | 2009-01-01 | - | s.n | 4.01 Contributo in Atti di convegno | - |
| 3D Contactless communication for IC design | R. Canegallo; L. Ciccarelli; F. Natali; A. Fazzi; R. Guerrieri; P. Rolandi | 2008-01-01 | - | IEEE | 4.01 Contributo in Atti di convegno | - |
| 3D Integration for Hybrid Integration of Integrated Circuits | E. Jung; S. Schmitz; K. Kaschlun; L. Magagni; A. Fazzi; R. Guerrieri; R. Canegallo | 2006-01-01 | - | s.n | 4.01 Contributo in Atti di convegno | - |
| 3D Technology based on aligned wafer-towafer direct bonding for capacitive coupling interconnectivity | B.Charlet; L.Di Cioccio; J.Dechamp; M.Zussy; T.Enot; R.Canegallo; A.Fazzi; R.Guerrieri | 2005-01-01 | - | s.n | 4.01 Contributo in Atti di convegno | - |
| A 0.14mW/Gbps High-Density Capacitive Interface for 3D System Integration | A.Fazzi; L.Magagni; M.Mirandola; R.Canegallo ; S.Schmitz; R.Guerrieri | 2005-01-01 | - | s.n | 4.01 Contributo in Atti di convegno | - |
| A CMOS based architecture for a distributed sensor matrix in underwater environment | L. Magagni; M. Sergio; M. Nicolini; D. Gennaretti; R. Canegallo ; R. Guerrieri | 2005-01-01 | - | s.n | 4.01 Contributo in Atti di convegno | - |
| A Fully Programmable eFPGA-Augmented SoC for Smart Power Applications | Renzini, Francesco; Mucci, Claudio; Rossi, Davide; Franchi Scarselli, Eleonora; Canegallo, Roberto | 2020-01-01 | IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS. I, REGULAR PAPERS | - | 1.01 Articolo in rivista | intero_no_format.pdf |
| A Low-Power System-on-Chip for the Documentation of Road Accidents | Bolcioni L. ; Campi F. ; Canegallo R. ; Guerrieri R. | 2005-01-01 | IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS FOR VIDEO TECHNOLOGY | - | 1.01 Articolo in rivista | - |
| A Smart Node Architecture for Underwater Monitoring of Sensor Networks | L. Magagni; M. Sergio; M. Nicolini; D. Gennaretti; R. Canegallo ; R. Guerrieri | 2005-01-01 | SENSORS AND ACTUATORS. A, PHYSICAL | - | 1.01 Articolo in rivista | - |
| A Textile Based CapacitivePressure Sensor | M. Sergio; D. Gennaretti; M. Nicolini; N. Manaresi; M. Tartagni; R. Canegallo; R. Guerrieri | 2004-01-01 | SENSOR LETTERS | - | 1.01 Articolo in rivista | - |
| A XiRisc-based SoC for Embedded DSP for Embedded DSP Applications | M. Bocchi; C. De Bartolomeis; C. Mucci; F. Campi; A. Lodi; M. Toma; R. Canegallo; R. Guerrieri | 2004-01-01 | - | s.n | 4.01 Contributo in Atti di convegno | - |
| BEE-DRONES: Energy-efficient Data Collection on Wake-Up Radio-based Wireless Sensor Networks | Trotta A.; Di Felice M.; Bononi L.; Natalizio E.; Perilli L.; Scarselli E.F.; Cinotti T.S.; Canegallo R. | 2019-01-01 | - | Institute of Electrical and Electronics Engineers Inc. | 4.01 Contributo in Atti di convegno | - |
| Characterization and Programming Algorithm of Phase Change Memory Cells for Analog In-Memory Computing | Antolini, Alessio; Franchi Scarselli, Eleonora; Gnudi, Antonio; Carissimi, Marcella; Pasotti, Marco; Romele, Paolo; Canegallo, Roberto | 2021-01-01 | MATERIALS | - | 1.01 Articolo in rivista | - |
| Chip-to-chip communication based on capacitive coupling | R. Cardu; M. Scandiuzzo; S. Cani; L. Perugini; E. Franchi Scarselli; R. Canegallo; R. Guerrieri | 2009-01-01 | - | s.n | 4.01 Contributo in Atti di convegno | - |
| Chip-to-chip interconnections based on the wireless capacitive coupling for 3D integration | B. Charlet; L. Di Cioccio; J. Dechamp; M.Zussy; T. Enot; R. Canegallo; A. Fazzi; R. Guerrieri; L. Magagni | 2006-01-01 | MICROELECTRONIC ENGINEERING | - | 1.01 Articolo in rivista | - |
| Dual-mode wake-up nodes for IoT monitoring applications: Measurements and algorithms | Bedogni, Luca; Bononi, Luciano; Canegallo, Roberto; Carbone, Fabio; Di Felice, Marco; Scarselli, Eleonora Franchi; Montori, Federico; Perilli, Luca; Cinotti, Tullio Salmon; Trotta, Angelo | 2018-01-01 | - | Institute of Electrical and Electronics Engineers Inc. | 4.01 Contributo in Atti di convegno | bare_conf.pdf |