An AC-coupled 3D memory interface for chip-to-chip communication is implemented in 90nm CMOS technology. It transfers 128 bit words between stacked SRAMs in an ARM-based System on Chip (SoC) platform at 250MHz. This interface requires 0.05mm2 of occupation area and achieves a 32Gbit/sec of throughput and an average energy consumption of 35μW/Gbit/sec.
Titolo: | System on Chip with 1.12mW-32Gb/s AC-Coupled 3D Memory Interface |
Autore/i: | CANEGALLO, ROBERTO; PERUGINI, LUCA; A. Pasini; M. Innocenti; M. Scandiuzzo; GUERRIERI, ROBERTO; P. L. Rolandi |
Autore/i Unibo: | |
Anno: | 2009 |
Titolo del libro: | Proceedings |
Pagina iniziale: | 463 |
Pagina finale: | 466 |
Digital Object Identifier (DOI): | http://dx.doi.org/10.1109/CICC.2009.5280782 |
Abstract: | An AC-coupled 3D memory interface for chip-to-chip communication is implemented in 90nm CMOS technology. It transfers 128 bit words between stacked SRAMs in an ARM-based System on Chip (SoC) platform at 250MHz. This interface requires 0.05mm2 of occupation area and achieves a 32Gbit/sec of throughput and an average energy consumption of 35μW/Gbit/sec. |
Data prodotto definitivo in UGOV: | 19-nov-2010 |
Appare nelle tipologie: | 4.01 Contributo in Atti di convegno |
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