An AC-coupled 3D memory interface for chip-to-chip communication is implemented in 90nm CMOS technology. It transfers 128 bit words between stacked SRAMs in an ARM-based System on Chip (SoC) platform at 250MHz. This interface requires 0.05mm2 of occupation area and achieves a 32Gbit/sec of throughput and an average energy consumption of 35μW/Gbit/sec.
R. Canegallo, L. Perugini, A. Pasini, M. Innocenti, M. Scandiuzzo, R. Guerrieri, et al. (2009). System on Chip with 1.12mW-32Gb/s AC-Coupled 3D Memory Interface. s.l : s.n [10.1109/CICC.2009.5280782].
System on Chip with 1.12mW-32Gb/s AC-Coupled 3D Memory Interface
CANEGALLO, ROBERTO;PERUGINI, LUCA;GUERRIERI, ROBERTO;
2009
Abstract
An AC-coupled 3D memory interface for chip-to-chip communication is implemented in 90nm CMOS technology. It transfers 128 bit words between stacked SRAMs in an ARM-based System on Chip (SoC) platform at 250MHz. This interface requires 0.05mm2 of occupation area and achieves a 32Gbit/sec of throughput and an average energy consumption of 35μW/Gbit/sec.File in questo prodotto:
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