A wireless interconnection scheme based on capacitive coupling provides mono- and bi-directional transmission capabilities for 3D system integration. Chips are implemented in 0.13mum CMOS and assembled face-to-face. RX-TX circuits are connected by 8times8mum 2 electrodes and this enables the vertical propagation of clock at 17GHz, a propagation delay of 420ps for general purpose signals and a throughput of more than 22Mb/s/mum2 with 0.08pJ/b energy consumption.
3D Capacitive Interconnections with Mono- and Bi-Directional Capabilities / A.Fazzi; R.Canegallo; L.Ciccarelli; L.Magagni; F.Natali; E.Jung; P.L.Rolandi; R.Guerrieri. - STAMPA. - (2007), pp. 356-608. (Intervento presentato al convegno IEEE International Solid-State Circuits Conference (ISSCC'07) tenutosi a San Francisco, CA, USA nel 11-15 Feb.2007).
3D Capacitive Interconnections with Mono- and Bi-Directional Capabilities
FAZZI, ALBERTO;CANEGALLO, ROBERTO;CICCARELLI, LUCA;MAGAGNI, LUCA;NATALI, FEDERICO;GUERRIERI, ROBERTO
2007
Abstract
A wireless interconnection scheme based on capacitive coupling provides mono- and bi-directional transmission capabilities for 3D system integration. Chips are implemented in 0.13mum CMOS and assembled face-to-face. RX-TX circuits are connected by 8times8mum 2 electrodes and this enables the vertical propagation of clock at 17GHz, a propagation delay of 420ps for general purpose signals and a throughput of more than 22Mb/s/mum2 with 0.08pJ/b energy consumption.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
