This paper presents a review of the solutions proposed for chip-to-chip communication based on capacitive coupling. Circuit designs, assembly options and various different test cases are presented in this work. It is shown that this 3D technology is capable of transferring digital data between two dies at highspeed with low power consumption, and likewise analog signals without the need for any extrawafer processing. The results presented highlight the key features of capacitive coupling when compared to other 3D interconnections and justify the effort to overcome some open issues and make it a marketable technology.

Chip-to-chip communication based on capacitive coupling

CARDU, ROBERTO;CANI, SALVATORE VALERIO;PERUGINI, LUCA;FRANCHI SCARSELLI, ELEONORA;CANEGALLO, ROBERTO;GUERRIERI, ROBERTO
2009

Abstract

This paper presents a review of the solutions proposed for chip-to-chip communication based on capacitive coupling. Circuit designs, assembly options and various different test cases are presented in this work. It is shown that this 3D technology is capable of transferring digital data between two dies at highspeed with low power consumption, and likewise analog signals without the need for any extrawafer processing. The results presented highlight the key features of capacitive coupling when compared to other 3D interconnections and justify the effort to overcome some open issues and make it a marketable technology.
2009
Proceedings
1
6
R. Cardu; M. Scandiuzzo; S. Cani; L. Perugini; E. Franchi Scarselli; R. Canegallo; R. Guerrieri
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11585/78253
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