PERUGINI, LUCA
 Distribuzione geografica
Continente #
NA - Nord America 815
EU - Europa 310
AS - Asia 204
AF - Africa 40
SA - Sud America 2
Totale 1.371
Nazione #
US - Stati Uniti d'America 812
GB - Regno Unito 91
VN - Vietnam 74
CN - Cina 61
IT - Italia 42
DE - Germania 41
SE - Svezia 41
SG - Singapore 35
UA - Ucraina 27
IN - India 18
TG - Togo 16
CI - Costa d'Avorio 15
FR - Francia 12
IE - Irlanda 11
RU - Federazione Russa 9
BG - Bulgaria 8
JO - Giordania 8
ZA - Sudafrica 7
BE - Belgio 6
EE - Estonia 6
FI - Finlandia 4
CA - Canada 3
GR - Grecia 3
TR - Turchia 3
CH - Svizzera 2
EC - Ecuador 2
AL - Albania 1
ES - Italia 1
HK - Hong Kong 1
HU - Ungheria 1
KW - Kuwait 1
LB - Libano 1
MY - Malesia 1
NG - Nigeria 1
NL - Olanda 1
NO - Norvegia 1
PL - Polonia 1
RO - Romania 1
SA - Arabia Saudita 1
SC - Seychelles 1
Totale 1.371
Città #
Ann Arbor 291
Southend 82
Fairfield 69
Ashburn 47
Chandler 44
Woodbridge 44
Wilmington 39
Santa Clara 35
Singapore 32
Houston 29
Seattle 29
Cambridge 27
Dong Ket 23
Princeton 18
Jacksonville 16
Lomé 16
Abidjan 15
Dublin 11
Boardman 10
Turin 10
Amman 8
Beijing 8
Nanjing 8
Padova 8
Sofia 8
Westminster 8
Brussels 6
Medford 6
Bologna 5
Hebei 5
Saint Petersburg 5
Berlin 4
Braunschweig 4
Des Moines 4
Helsinki 4
Tianjin 4
Frankfurt am Main 3
Milan 3
Mülheim 3
New York 3
Ningbo 3
Phoenix 3
San Francisco 3
Shenyang 3
Aigaleo 2
Bremen 2
Castel Maggiore 2
Crespellano 2
Falkenstein 2
Fermo 2
Guangzhou 2
Henderson 2
Jinan 2
Kunming 2
Norwalk 2
Quito 2
San Diego 2
San Venanzo 2
Shenzhen 2
Taiyuan 2
Toronto 2
Washington 2
Abeokuta 1
Amsterdam 1
Baotou 1
Bühl 1
Changsha 1
Chaozhou 1
Dearborn 1
Fremont 1
Haikou 1
Haimen 1
Hanover 1
Jeffries 1
Kuala Lumpur 1
Kuwait City 1
Langfang 1
Lanzhou 1
Leawood 1
London 1
Madrid 1
Mahé 1
Moscow 1
Mumbai 1
Nanchang 1
Napoli 1
Olalla 1
Pune 1
Redwood City 1
Rimini 1
Riyadh 1
Sacramento 1
Stoney Creek 1
Taizhou 1
Tallinn 1
Tangshan 1
Tirana 1
Warsaw 1
Weifang 1
Zhengzhou 1
Totale 1.080
Nome #
3D System on chip memory interface based on modeled capacitive coupling interconnections 217
Input/Output pad for direct contact and contactless testing 179
A 40 nm CMOS I/O Pad Design With Embedded Capacitive Coupling Receiver for Non-Contact Wafer Probe Test 179
System on Chip with 1.12mW-32Gb/s AC-Coupled 3D Memory Interface 174
Multicore Signal Processing Platform With Heterogeneous Configurable Hardware Accelerators 169
Chip-to-chip communication based on capacitive coupling 163
The Dream Digital Signal Processor: Architecture, programming model and application mapping 159
Characterization of chip-to-chip wireless interconnections based on capacitive coupling 148
Totale 1.388
Categoria #
all - tutte 2.788
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 2.788


Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2019/2020197 0 0 0 0 0 26 40 39 52 17 10 13
2020/2021158 28 7 10 6 0 5 6 11 18 5 10 52
2021/2022497 42 5 50 48 60 40 42 45 44 21 42 58
2022/2023207 15 40 11 29 8 20 7 12 41 1 21 2
2023/202446 3 8 2 3 3 16 1 6 1 1 0 2
2024/2025110 14 20 17 8 40 11 0 0 0 0 0 0
Totale 1.388