Non-contact probing can provide an important contribution for testing complex Systems-on-a-Chip (SoC), Systems-in-a-Package (SiP) and Through-Silicon-Vias (TSV) interconnections. This paper demonstrates the feasibility of wireless testing by capacitive coupling between a cantilever probe card and a pad. In particular a scheme of an I/O pad suitable for both contact and contactless probing is proposed.

Input/Output pad for direct contact and contactless testing

PERUGINI, LUCA;PERILLI, LUCA;FRANCHI SCARSELLI, ELEONORA;
2011

Abstract

Non-contact probing can provide an important contribution for testing complex Systems-on-a-Chip (SoC), Systems-in-a-Package (SiP) and Through-Silicon-Vias (TSV) interconnections. This paper demonstrates the feasibility of wireless testing by capacitive coupling between a cantilever probe card and a pad. In particular a scheme of an I/O pad suitable for both contact and contactless probing is proposed.
Proceedings of IEEE 16th European Test Symposium (ETS 2011)
135
140
M.Scandiuzzo; S. Cani; L.Perugini; S. Spolzino; R. Canegallo; L.Perilli; R. Cardu; E. Franchi Scarselli; C. Gozzi; F. Maggioni
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11585/106934
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