Non-contact probing can provide an important contribution for testing complex Systems-on-a-Chip (SoC), Systems-in-a-Package (SiP) and Through-Silicon-Vias (TSV) interconnections. This paper demonstrates the feasibility of wireless testing by capacitive coupling between a cantilever probe card and a pad. In particular a scheme of an I/O pad suitable for both contact and contactless probing is proposed.
M.Scandiuzzo, S. Cani, L.Perugini, S. Spolzino, R. Canegallo, L.Perilli, et al. (2011). Input/Output pad for direct contact and contactless testing. s.l : IEEE Computer Society [10.1109/ETS.2011.24].
Input/Output pad for direct contact and contactless testing
PERUGINI, LUCA;PERILLI, LUCA;FRANCHI SCARSELLI, ELEONORA;
2011
Abstract
Non-contact probing can provide an important contribution for testing complex Systems-on-a-Chip (SoC), Systems-in-a-Package (SiP) and Through-Silicon-Vias (TSV) interconnections. This paper demonstrates the feasibility of wireless testing by capacitive coupling between a cantilever probe card and a pad. In particular a scheme of an I/O pad suitable for both contact and contactless probing is proposed.File in questo prodotto:
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