We present Occamy, a 432-core RISC-V dual-chiplet 2.5D system for efficient sparse linear algebra and stencil computations on FP64 and narrow (32-, 16-, 8-bit) SIMD FP data. Occamy features 48 clusters of RISC-V cores with custom extensions, two 64-bit host cores, and a latency-tolerant multi-chiplet interconnect and memory system with 32 GiB of HBM2E. It achieves leading-edge utilization on stencils (83%), sparse-dense (42 %), and sparse-sparse (49 %) matrix multiply.

Paulin, G., Scheffler, P., Benz, T., Cavalcante, M., Fischer, T., Eggimann, M., et al. (2024). Occamy: A 432-Core 28.1 DP-GFLOP/s/W 83% FPU Utilization Dual-Chiplet, Dual-HBM2E RISC-V-Based Accelerator for Stencil and Sparse Linear Algebra Computations with 8-to-64-bit Floating-Point Support in 12nm FinFET. Institute of Electrical and Electronics Engineers Inc. [10.1109/VLSITechnologyandCir46783.2024.10631529].

Occamy: A 432-Core 28.1 DP-GFLOP/s/W 83% FPU Utilization Dual-Chiplet, Dual-HBM2E RISC-V-Based Accelerator for Stencil and Sparse Linear Algebra Computations with 8-to-64-bit Floating-Point Support in 12nm FinFET

Paulin G.;Bertaccini L.;Ottavi G.;Rossi D.;Benini L.
2024

Abstract

We present Occamy, a 432-core RISC-V dual-chiplet 2.5D system for efficient sparse linear algebra and stencil computations on FP64 and narrow (32-, 16-, 8-bit) SIMD FP data. Occamy features 48 clusters of RISC-V cores with custom extensions, two 64-bit host cores, and a latency-tolerant multi-chiplet interconnect and memory system with 32 GiB of HBM2E. It achieves leading-edge utilization on stencils (83%), sparse-dense (42 %), and sparse-sparse (49 %) matrix multiply.
2024
Digest of Technical Papers - Symposium on VLSI Technology
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Paulin, G., Scheffler, P., Benz, T., Cavalcante, M., Fischer, T., Eggimann, M., et al. (2024). Occamy: A 432-Core 28.1 DP-GFLOP/s/W 83% FPU Utilization Dual-Chiplet, Dual-HBM2E RISC-V-Based Accelerator for Stencil and Sparse Linear Algebra Computations with 8-to-64-bit Floating-Point Support in 12nm FinFET. Institute of Electrical and Electronics Engineers Inc. [10.1109/VLSITechnologyandCir46783.2024.10631529].
Paulin, G.; Scheffler, P.; Benz, T.; Cavalcante, M.; Fischer, T.; Eggimann, M.; Zhang, Y.; Wistoff, N.; Bertaccini, L.; Colagrande, L.; Ottavi, G.; Gu...espandi
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11585/1004841
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