statistiche ricercatore

Continente	#
NA - Nord America	1.305
AS - Asia	878
EU - Europa	665
AF - Africa	85
SA - Sud America	23
Continente sconosciuto - Info sul continente non disponibili	1
OC - Oceania	1
Totale	2.958

Nazione	#
US - Stati Uniti d'America	1.297
VN - Vietnam	308
CN - Cina	218
SG - Singapore	191
GB - Regno Unito	146
DE - Germania	87
SE - Svezia	75
UA - Ucraina	74
IT - Italia	73
HK - Hong Kong	45
FR - Francia	43
NL - Olanda	38
IN - India	33
RU - Federazione Russa	32
TG - Togo	32
KR - Corea	31
FI - Finlandia	22
IE - Irlanda	20
CI - Costa d'Avorio	16
BG - Bulgaria	13
BR - Brasile	13
ZA - Sudafrica	13
JO - Giordania	12
JP - Giappone	12
NG - Nigeria	12
BE - Belgio	11
GR - Grecia	11
SC - Seychelles	9
CA - Canada	7
EE - Estonia	7
PH - Filippine	6
AR - Argentina	4
CH - Svizzera	4
TR - Turchia	4
CL - Cile	3
IL - Israele	3
PL - Polonia	3
AE - Emirati Arabi Uniti	2
EG - Egitto	2
ES - Italia	2
IR - Iran	2
KZ - Kazakistan	2
LT - Lituania	2
PY - Paraguay	2
SA - Arabia Saudita	2
AT - Austria	1
AU - Australia	1
BD - Bangladesh	1
CO - Colombia	1
ID - Indonesia	1
IQ - Iraq	1
KH - Cambogia	1
MA - Marocco	1
MX - Messico	1
PK - Pakistan	1
PT - Portogallo	1
TH - Thailandia	1
TW - Taiwan	1
XK - ???statistics.table.value.countryCode.XK???	1
Totale	2.958

Nome	#
A 0.14mW/Gbps High-Density Capacitive Interface for 3D System Integration	383
A Smart Node Architecture for Underwater Monitoring of Sensor Networks	300
3D Capacitive Interconnections for High Speed Interchip Communication	269
A CMOS based architecture for a distributed sensor matrix in underwater environment	261
Electrical Measurement of alignment for 3D stacked chips	241
3-D Capacitive Interconnections for Wafer-Level and Die-Level Assembly	234
3-D Capacitive Interconnections With Mono- and Bi-Directional Capabilities	233
3D Capacitive Interconnections with Mono- and Bi-Directional Capabilities	228
Chip-to-chip interconnections based on the wireless capacitive coupling for 3D integration	222
3D Integration for Hybrid Integration of Integrated Circuits	217
Model for a smart Network monitoring a Wired Sensor Matrix	205
Yield Prediction for 3D Capacitive Interconnections	190
Totale	2.983

	Totale	Lug	Ago	Sett	Ott	Nov	Dic	Gen	Feb	Mar	Apr	Mag	Giu
2020/2021	108	0	0	0	0	0	0	0	0	0	18	10	80
2021/2022	814	150	5	76	81	82	66	67	62	77	28	56	64
2022/2023	368	35	71	24	44	32	33	6	21	60	1	33	8
2023/2024	82	9	11	8	6	7	23	3	2	0	10	0	3
2024/2025	309	10	28	23	19	57	16	9	13	0	34	19	81
2025/2026	587	49	67	66	47	81	53	54	28	107	35	0	0
Totale													2.983

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