MAGAGNI, LUCA
 Distribuzione geografica
Continente #
NA - Nord America 1.103
EU - Europa 566
AS - Asia 320
AF - Africa 69
SA - Sud America 2
OC - Oceania 1
Totale 2.061
Nazione #
US - Stati Uniti d'America 1.100
VN - Vietnam 202
GB - Regno Unito 141
DE - Germania 77
UA - Ucraina 74
SE - Svezia 73
IT - Italia 70
CN - Cina 67
TG - Togo 32
FR - Francia 31
IN - India 27
RU - Federazione Russa 22
IE - Irlanda 20
BG - Bulgaria 13
JO - Giordania 12
NG - Nigeria 12
BE - Belgio 10
CI - Costa d'Avorio 10
FI - Finlandia 10
GR - Grecia 10
ZA - Sudafrica 8
EE - Estonia 7
SC - Seychelles 6
CH - Svizzera 4
CA - Canada 3
JP - Giappone 3
CL - Cile 2
IR - Iran 2
KZ - Kazakistan 2
NL - Olanda 2
TR - Turchia 2
AE - Emirati Arabi Uniti 1
AU - Australia 1
EG - Egitto 1
IL - Israele 1
KR - Corea 1
PL - Polonia 1
PT - Portogallo 1
Totale 2.061
Città #
Ann Arbor 436
Dong Ket 146
Southend 120
Chandler 100
Fairfield 77
Jacksonville 53
Ashburn 48
Woodbridge 46
Seattle 45
Wilmington 45
Cambridge 37
Houston 33
Lomé 32
Princeton 24
Bologna 20
Dublin 20
Turin 14
Sofia 13
Westminster 13
Abeokuta 12
Amman 12
Padova 12
Abidjan 10
Braunschweig 10
Brussels 10
Helsinki 10
Nanjing 10
Hebei 9
Berlin 8
Medford 8
Jinan 7
Milan 7
Mülheim 7
San Diego 7
Shenyang 7
Mahé 6
Saint Petersburg 6
Des Moines 5
Pune 5
Bern 4
Bremen 4
Changsha 4
Kunming 4
Paris 4
Beijing 3
Jiaxing 3
Nanchang 3
Taizhou 3
Tokyo 3
Verona 3
Zhengzhou 3
Almaty 2
Boardman 2
Grafing 2
Las Vegas 2
Moscow 2
Ningbo 2
Norwalk 2
Olalla 2
Athens 1
Buffalo 1
Cairo 1
Dearborn 1
Den Haag 1
Frankfurt Am Main 1
Genzano Di Roma 1
Guiyang 1
Haifa 1
Hangzhou 1
La Canada Flintridge 1
Lanzhou 1
Leipzig 1
Markham 1
Mehr 1
Nanning 1
Newark 1
North York 1
Novokuznetsk 1
Nuremberg 1
Olinda 1
Providence 1
San Francisco 1
Toronto 1
Udine 1
Zanjan 1
Zhongxin 1
Totale 1.574
Nome #
A 0.14mW/Gbps High-Density Capacitive Interface for 3D System Integration 245
A Smart Node Architecture for Underwater Monitoring of Sensor Networks 225
3D Capacitive Interconnections for High Speed Interchip Communication 194
A CMOS based architecture for a distributed sensor matrix in underwater environment 189
3-D Capacitive Interconnections for Wafer-Level and Die-Level Assembly 176
Chip-to-chip interconnections based on the wireless capacitive coupling for 3D integration 166
3-D Capacitive Interconnections With Mono- and Bi-Directional Capabilities 163
3D Capacitive Interconnections with Mono- and Bi-Directional Capabilities 162
Electrical Measurement of alignment for 3D stacked chips 155
3D Integration for Hybrid Integration of Integrated Circuits 148
Model for a smart Network monitoring a Wired Sensor Matrix 138
Yield Prediction for 3D Capacitive Interconnections 123
Totale 2.084
Categoria #
all - tutte 3.680
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 3.680


Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2018/201913 0 0 0 0 0 0 0 0 0 0 7 6
2019/2020406 61 4 12 29 30 55 47 58 41 30 11 28
2020/2021255 44 20 0 17 5 11 10 18 22 18 10 80
2021/2022814 150 5 76 81 82 66 67 62 77 28 56 64
2022/2023368 35 71 24 44 32 33 6 21 60 1 33 8
2023/202479 9 11 8 6 7 23 3 2 0 10 0 0
Totale 2.084