statistiche ricercatore

Continente	#
NA - Nord America	1.386
AS - Asia	884
EU - Europa	667
AF - Africa	85
SA - Sud America	28
Continente sconosciuto - Info sul continente non disponibili	26
OC - Oceania	1
Totale	3.077

Nazione	#
US - Stati Uniti d'America	1.376
VN - Vietnam	308
CN - Cina	220
SG - Singapore	192
GB - Regno Unito	146
DE - Germania	87
SE - Svezia	75
UA - Ucraina	74
IT - Italia	73
HK - Hong Kong	46
FR - Francia	43
NL - Olanda	39
IN - India	33
RU - Federazione Russa	32
TG - Togo	32
KR - Corea	31
FI - Finlandia	22
IE - Irlanda	20
CI - Costa d'Avorio	16
BG - Bulgaria	13
BR - Brasile	13
ZA - Sudafrica	13
JO - Giordania	12
JP - Giappone	12
NG - Nigeria	12
BE - Belgio	11
GR - Grecia	11
SC - Seychelles	9
CA - Canada	7
EE - Estonia	7
PH - Filippine	7
AR - Argentina	5
CH - Svizzera	4
TR - Turchia	4
CL - Cile	3
IL - Israele	3
PL - Polonia	3
AE - Emirati Arabi Uniti	2
BD - Bangladesh	2
CO - Colombia	2
EC - Ecuador	2
EG - Egitto	2
ES - Italia	2
IR - Iran	2
KZ - Kazakistan	2
LT - Lituania	2
PY - Paraguay	2
SA - Arabia Saudita	2
AT - Austria	1
AU - Australia	1
CR - Costa Rica	1
ID - Indonesia	1
IQ - Iraq	1
KH - Cambogia	1
MA - Marocco	1
MX - Messico	1
NO - Norvegia	1
PA - Panama	1
PK - Pakistan	1
PT - Portogallo	1
TH - Thailandia	1
TW - Taiwan	1
VE - Venezuela	1
XK - ???statistics.table.value.countryCode.XK???	1
Totale	3.052

Nome	#
A 0.14mW/Gbps High-Density Capacitive Interface for 3D System Integration	397
A Smart Node Architecture for Underwater Monitoring of Sensor Networks	306
3D Capacitive Interconnections for High Speed Interchip Communication	282
A CMOS based architecture for a distributed sensor matrix in underwater environment	264
Electrical Measurement of alignment for 3D stacked chips	248
3-D Capacitive Interconnections for Wafer-Level and Die-Level Assembly	240
3-D Capacitive Interconnections With Mono- and Bi-Directional Capabilities	240
3D Capacitive Interconnections with Mono- and Bi-Directional Capabilities	236
Chip-to-chip interconnections based on the wireless capacitive coupling for 3D integration	231
3D Integration for Hybrid Integration of Integrated Circuits	225
Model for a smart Network monitoring a Wired Sensor Matrix	214
Yield Prediction for 3D Capacitive Interconnections	194
Totale	3.077

	Totale	Lug	Ago	Sett	Ott	Nov	Dic	Gen	Feb	Mar	Apr	Mag	Giu
2021/2022	659	0	0	76	81	82	66	67	62	77	28	56	64
2022/2023	368	35	71	24	44	32	33	6	21	60	1	33	8
2023/2024	82	9	11	8	6	7	23	3	2	0	10	0	3
2024/2025	309	10	28	23	19	57	16	9	13	0	34	19	81
2025/2026	637	49	67	66	47	81	53	54	28	107	41	13	31
2026/2027	44	6	13	25	0	0	0	0	0	0	0	0	0
Totale													3.077

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