MAGAGNI, LUCA
 Distribuzione geografica
Continente #
NA - Nord America 1.103
EU - Europa 567
AS - Asia 332
AF - Africa 69
SA - Sud America 2
OC - Oceania 1
Totale 2.074
Nazione #
US - Stati Uniti d'America 1.100
VN - Vietnam 202
GB - Regno Unito 141
DE - Germania 77
UA - Ucraina 74
SE - Svezia 73
IT - Italia 71
CN - Cina 67
TG - Togo 32
FR - Francia 31
IN - India 27
RU - Federazione Russa 22
IE - Irlanda 20
BG - Bulgaria 13
JO - Giordania 12
NG - Nigeria 12
SG - Singapore 12
BE - Belgio 10
CI - Costa d'Avorio 10
FI - Finlandia 10
GR - Grecia 10
ZA - Sudafrica 8
EE - Estonia 7
SC - Seychelles 6
CH - Svizzera 4
CA - Canada 3
JP - Giappone 3
CL - Cile 2
IR - Iran 2
KZ - Kazakistan 2
NL - Olanda 2
TR - Turchia 2
AE - Emirati Arabi Uniti 1
AU - Australia 1
EG - Egitto 1
IL - Israele 1
KR - Corea 1
PL - Polonia 1
PT - Portogallo 1
Totale 2.074
Città #
Ann Arbor 436
Dong Ket 146
Southend 120
Chandler 100
Fairfield 77
Jacksonville 53
Ashburn 48
Woodbridge 46
Seattle 45
Wilmington 45
Cambridge 37
Houston 33
Lomé 32
Princeton 24
Bologna 20
Dublin 20
Turin 14
Sofia 13
Westminster 13
Abeokuta 12
Amman 12
Padova 12
Abidjan 10
Braunschweig 10
Brussels 10
Helsinki 10
Nanjing 10
Hebei 9
Singapore 9
Berlin 8
Medford 8
Milan 8
Jinan 7
Mülheim 7
San Diego 7
Shenyang 7
Mahé 6
Saint Petersburg 6
Des Moines 5
Pune 5
Bern 4
Bremen 4
Changsha 4
Kunming 4
Paris 4
Beijing 3
Jiaxing 3
Nanchang 3
Taizhou 3
Tokyo 3
Verona 3
Zhengzhou 3
Almaty 2
Boardman 2
Grafing 2
Las Vegas 2
Moscow 2
Ningbo 2
Norwalk 2
Olalla 2
Athens 1
Buffalo 1
Cairo 1
Dearborn 1
Den Haag 1
Frankfurt Am Main 1
Genzano Di Roma 1
Guiyang 1
Haifa 1
Hangzhou 1
La Canada Flintridge 1
Lanzhou 1
Leipzig 1
Markham 1
Mehr 1
Nanning 1
Newark 1
North York 1
Novokuznetsk 1
Nuremberg 1
Olinda 1
Providence 1
San Francisco 1
Toronto 1
Udine 1
Zanjan 1
Zhongxin 1
Totale 1.584
Nome #
A 0.14mW/Gbps High-Density Capacitive Interface for 3D System Integration 246
A Smart Node Architecture for Underwater Monitoring of Sensor Networks 226
3D Capacitive Interconnections for High Speed Interchip Communication 196
A CMOS based architecture for a distributed sensor matrix in underwater environment 190
3-D Capacitive Interconnections for Wafer-Level and Die-Level Assembly 177
Chip-to-chip interconnections based on the wireless capacitive coupling for 3D integration 167
3-D Capacitive Interconnections With Mono- and Bi-Directional Capabilities 164
3D Capacitive Interconnections with Mono- and Bi-Directional Capabilities 164
Electrical Measurement of alignment for 3D stacked chips 156
3D Integration for Hybrid Integration of Integrated Circuits 149
Model for a smart Network monitoring a Wired Sensor Matrix 138
Yield Prediction for 3D Capacitive Interconnections 124
Totale 2.097
Categoria #
all - tutte 3.898
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 3.898


Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2019/2020345 0 4 12 29 30 55 47 58 41 30 11 28
2020/2021255 44 20 0 17 5 11 10 18 22 18 10 80
2021/2022814 150 5 76 81 82 66 67 62 77 28 56 64
2022/2023368 35 71 24 44 32 33 6 21 60 1 33 8
2023/202482 9 11 8 6 7 23 3 2 0 10 0 3
2024/202510 10 0 0 0 0 0 0 0 0 0 0 0
Totale 2.097