CICCARELLI, LUCA
 Distribuzione geografica
Continente #
NA - Nord America 959
EU - Europa 420
AS - Asia 331
AF - Africa 48
SA - Sud America 4
Totale 1.762
Nazione #
US - Stati Uniti d'America 955
VN - Vietnam 155
GB - Regno Unito 108
CN - Cina 86
SE - Svezia 63
DE - Germania 56
SG - Singapore 51
IT - Italia 44
UA - Ucraina 36
RU - Federazione Russa 24
IE - Irlanda 23
IN - India 22
TG - Togo 21
FR - Francia 17
FI - Finlandia 14
BG - Bulgaria 10
CI - Costa d'Avorio 10
JO - Giordania 10
BE - Belgio 8
EE - Estonia 8
NG - Nigeria 8
ZA - Sudafrica 7
CA - Canada 3
IR - Iran 3
AT - Austria 2
CL - Cile 2
GR - Grecia 2
KZ - Kazakistan 2
NL - Olanda 2
SC - Seychelles 2
AR - Argentina 1
BR - Brasile 1
CH - Svizzera 1
DO - Repubblica Dominicana 1
IL - Israele 1
JP - Giappone 1
LV - Lettonia 1
PL - Polonia 1
Totale 1.762
Città #
Ann Arbor 367
Dong Ket 127
Southend 98
Fairfield 74
Chandler 64
Ashburn 62
Singapore 47
Woodbridge 38
Wilmington 36
Houston 35
Santa Clara 34
Seattle 34
Cambridge 33
Dublin 23
Jacksonville 23
Lomé 21
Princeton 20
Bologna 14
Helsinki 14
Boardman 12
Abidjan 10
Amman 10
Padova 10
Sofia 10
Westminster 10
Nanjing 9
Shenyang 9
Abeokuta 8
Beijing 8
Brussels 8
Turin 8
Berlin 7
Medford 7
Jinan 6
Braunschweig 5
Bremen 5
Milan 5
Nanchang 5
San Diego 5
Changsha 4
Des Moines 4
Wuhan 4
Hebei 3
Jiaxing 3
Lanzhou 3
Mülheim 3
Pune 3
Almaty 2
Amsterdam 2
Bühl 2
Falkenstein 2
Foshan 2
Mahé 2
Ningbo 2
Saint Petersburg 2
Taiyuan 2
Toronto 2
Zhengzhou 2
Bern 1
Boston 1
Changle 1
Charlotte 1
Chicago 1
Dalian 1
Dearborn 1
Genzano Di Roma 1
Guangzhou 1
Guiyang 1
Haifa 1
Haikou 1
Hangzhou 1
Hanover 1
Harbin 1
Henderson 1
Kunming 1
La Canada Flintridge 1
Leawood 1
Ludwigshafen 1
Norwalk 1
Novokuznetsk 1
Olalla 1
Paris 1
Qingdao 1
Saint Louis 1
Shanghai 1
São Paulo 1
Tianjin 1
Tokyo 1
Vancouver 1
Verona 1
Vienna 1
Warsaw 1
Weifang 1
Yubileyny 1
Zanjan 1
Totale 1.407
Nome #
A reconfigurable heterogeneous multiprocessor System on Chip 227
3D Capacitive Interconnections for High Speed Interchip Communication 212
3D Contactless communication for IC design 192
3D Capacitive transmission of analog signals with automatic compensation of the voltage attenuation 189
3-D Capacitive Interconnections With Mono- and Bi-Directional Capabilities 178
3D Capacitive Interconnections with Mono- and Bi-Directional Capabilities 173
XiSystem: a XiRisc-based SoC with reconfigurable IO module 170
XiSystem: a XiRisc-based SoC with Reconfigurable IO module 154
Low Leakage Design of LUT-based FPGAs 147
Low leakage techniques for FPGAs 141
Totale 1.783
Categoria #
all - tutte 3.657
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 3.657


Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2019/2020191 0 0 0 0 0 0 41 47 42 23 15 23
2020/2021183 35 9 5 9 1 10 6 9 16 12 8 63
2021/2022659 118 2 74 62 65 53 56 48 67 27 44 43
2022/2023269 23 46 15 45 19 26 5 9 51 1 25 4
2023/202466 7 12 3 3 5 16 1 13 1 2 0 3
2024/2025164 15 26 20 19 50 24 10 0 0 0 0 0
Totale 1.783