An AC-coupled 3D memory interface for chip-to-chip communication is implemented in 90nm CMOS technology. It transfers 128 bit words between stacked SRAMs in an ARM-based System on Chip (SoC) platform at 250MHz. This interface requires 0.05mm2 of occupation area and achieves a 32Gbit/sec of throughput and an average energy consumption of 35μW/Gbit/sec.
System on Chip with 1.12mW-32Gb/s AC-Coupled 3D Memory Interface / R. Canegallo; L. Perugini; A. Pasini; M. Innocenti; M. Scandiuzzo; R. Guerrieri; P.L. Rolandi. - STAMPA. - 2009:(2009), pp. 463-466. (Intervento presentato al convegno IEEE 2009 Custom Intergrated Circuits Conference (CICC) tenutosi a San Josè, CA (USA) nel 20-22 September 2009) [10.1109/CICC.2009.5280782].
System on Chip with 1.12mW-32Gb/s AC-Coupled 3D Memory Interface
CANEGALLO, ROBERTO;PERUGINI, LUCA;GUERRIERI, ROBERTO;
2009
Abstract
An AC-coupled 3D memory interface for chip-to-chip communication is implemented in 90nm CMOS technology. It transfers 128 bit words between stacked SRAMs in an ARM-based System on Chip (SoC) platform at 250MHz. This interface requires 0.05mm2 of occupation area and achieves a 32Gbit/sec of throughput and an average energy consumption of 35μW/Gbit/sec.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
