This work presents on-wafer characterization measurements of the X-Hall current sensor architecture implemented in 90-nm BCD10 silicon process by STMicroelectronics. With respect to a previous implementation, technological improvements in terms of active region, isolation layers, and metal stack configuration result in a substantially improved sensitivity. In addition, it is reported that the sensitivity can be further improved by applying a negative voltage to the depletion layer.

Static Characterization of the X-Hall Current Sensor in BCD10 Technology

Gibiino G. P.
;
Crescentini M.;Romani A.;Traverso P. A.
2022

Abstract

This work presents on-wafer characterization measurements of the X-Hall current sensor architecture implemented in 90-nm BCD10 silicon process by STMicroelectronics. With respect to a previous implementation, technological improvements in terms of active region, isolation layers, and metal stack configuration result in a substantially improved sensitivity. In addition, it is reported that the sensitivity can be further improved by applying a negative voltage to the depletion layer.
2022
25th IMEKO TC4 International Symposium 23rd International Workshop on ADC and DAC Modelling and Testing
315
319
Gibiino G.P.; Crescentini M.; Marchesi M.; Cogliati M.; Romani A.; Traverso P.A.
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11585/914211
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