Optimal deployment of deep neural networks (DNNs) on state-of-the-art Systems-on-Chips (SoCs) is crucial for tiny machine learning (TinyML) at the edge. The complexity of these SoCs makes deployment non-trivial, as they typically contain multiple heterogeneous compute cores with limited, programmer-managed memory to optimize latency and energy efficiency. We propose HTVM - a compiler that merges TVM with DORY to maximize the utilization of heterogeneous accelerators and minimize data movements. HTVM allows deploying the MLPerfT Tiny suite on DIANA, an SoC with a RISC-V CPU, and digital and analog compute-in-memory AI accelerators, at 120x improved performance over plain TVM deployment.

Van Delm, J., Vandersteegenl, M., Burrello, A., Sarda, G.M., Conti, F., Pagliari, D.J., et al. (2023). HTVM: Efficient Neural Network Deployment On Heterogeneous TinyML Platforms. 345 E 47TH ST, NEW YORK, NY 10017 USA : IEEE [10.1109/DAC56929.2023.10247664].

HTVM: Efficient Neural Network Deployment On Heterogeneous TinyML Platforms

Burrello, A;Conti, F;Benini, L;
2023

Abstract

Optimal deployment of deep neural networks (DNNs) on state-of-the-art Systems-on-Chips (SoCs) is crucial for tiny machine learning (TinyML) at the edge. The complexity of these SoCs makes deployment non-trivial, as they typically contain multiple heterogeneous compute cores with limited, programmer-managed memory to optimize latency and energy efficiency. We propose HTVM - a compiler that merges TVM with DORY to maximize the utilization of heterogeneous accelerators and minimize data movements. HTVM allows deploying the MLPerfT Tiny suite on DIANA, an SoC with a RISC-V CPU, and digital and analog compute-in-memory AI accelerators, at 120x improved performance over plain TVM deployment.
2023
2023 60th ACM/IEEE Design Automation Conference (DAC)
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Van Delm, J., Vandersteegenl, M., Burrello, A., Sarda, G.M., Conti, F., Pagliari, D.J., et al. (2023). HTVM: Efficient Neural Network Deployment On Heterogeneous TinyML Platforms. 345 E 47TH ST, NEW YORK, NY 10017 USA : IEEE [10.1109/DAC56929.2023.10247664].
Van Delm, J; Vandersteegenl, M; Burrello, A; Sarda, GM; Conti, F; Pagliari, DJ; Benini, L; Verhelst, M
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11585/953201
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