Three-dimensional integrated circuits, where multiple silicon layers are stacked vertically have emerged recently. The3DICs have smaller form factor, shorter and efficient use of wires and allow integration of diverse technologies in the same device. The use of Networks on Chips (NoCs) to connect components in a 3D chip is a necessity. In this short paper, we present an outline on designing application-specific NoCs for 3D ICs.

Design of Networks on Chips for 3D ICs

BENINI, LUCA;
2010

Abstract

Three-dimensional integrated circuits, where multiple silicon layers are stacked vertically have emerged recently. The3DICs have smaller form factor, shorter and efficient use of wires and allow integration of diverse technologies in the same device. The use of Networks on Chips (NoCs) to connect components in a 3D chip is a necessity. In this short paper, we present an outline on designing application-specific NoCs for 3D ICs.
Design Automation Conference (ASP-DAC), 2010 15th Asia and South Pacific
167
168
Murali S.; Benini L.; De Micheli G.
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Utilizza questo identificativo per citare o creare un link a questo documento: http://hdl.handle.net/11585/94675
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