A simple beam model for the evaluation of tile debonding due to substrate shrinkage is presented. The tile-adhesive-substrate package is modeled as an Euler-Bernoulli beam laying on a two-layer elastic foundation. An effective discrete model for inter-tile grouting is introduced with the aim of modelling workmanship defects due to partial filled groutings. The model is validated using the results of a 2D FE model. Different defect configurations and adhesive typologies are analysed, focusing the attention on the prediction of normal stresses in the adhesive layer under the assumption of Mode I failure of the adhesive.

de Miranda, S., Palermo, A., Ubertini, F. (2014). A simple beam model to analyse the durability of adhesively bonded tile floorings in presence of shrinkage. FRATTURA E INTEGRITÀ STRUTTURALE, 8(29), 293-301 [10.3221/IGF-ESIS.29.25].

A simple beam model to analyse the durability of adhesively bonded tile floorings in presence of shrinkage

DE MIRANDA, STEFANO;PALERMO, ANTONIO;UBERTINI, FRANCESCO
2014

Abstract

A simple beam model for the evaluation of tile debonding due to substrate shrinkage is presented. The tile-adhesive-substrate package is modeled as an Euler-Bernoulli beam laying on a two-layer elastic foundation. An effective discrete model for inter-tile grouting is introduced with the aim of modelling workmanship defects due to partial filled groutings. The model is validated using the results of a 2D FE model. Different defect configurations and adhesive typologies are analysed, focusing the attention on the prediction of normal stresses in the adhesive layer under the assumption of Mode I failure of the adhesive.
2014
de Miranda, S., Palermo, A., Ubertini, F. (2014). A simple beam model to analyse the durability of adhesively bonded tile floorings in presence of shrinkage. FRATTURA E INTEGRITÀ STRUTTURALE, 8(29), 293-301 [10.3221/IGF-ESIS.29.25].
de Miranda, S.; Palermo, A.; Ubertini, F.
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11585/521334
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