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EnglishThe power density inside high performance systems continues to rise with every process technology generation, thereby increasing the operating temperature and creating "hot spots" on the die. As a result, the performance, reliability and power consumption of the system degrade. To avoid these "hot spots", "temperature-aware" design has become a must. For low-power embedded systems though, it is not clear whether similar thermal problems occur. These systems have very different characteristics from the high performance ones: they consume hundred times less power, they are based on a multi-processor architecture with lots of embedded memory and rely on cheap packaging solutions. In this paper, we investigate the need for temperature-aware design in a low-power systems-on-a-chip and provide guidlines to delimit the conditions for which temperature-aware design is needed.
| Titolo: | Exploring "temperature-aware" design in low-power MPSoCs | |
| Autore/i: | PACI, GIACOMO; P. Marchal; POLETTI, FRANCESCO; BENINI, LUCA | |
| Autore/i Unibo: | ||
| Anno: | 2006 | |
| Titolo del libro: | Proceedings of the conference on Design, automation and test in Europe. SESSION: Thermal aspects of low power design | |
| Pagina iniziale: | 838 | |
| Pagina finale: | 843 | |
| Abstract: | The power density inside high performance systems continues to rise with every process technology generation, thereby increasing the operating temperature and creating "hot spots" on the die. As a result, the performance, reliability and power consumption of the system degrade. To avoid these "hot spots", "temperature-aware" design has become a must. For low-power embedded systems though, it is not clear whether similar thermal problems occur. These systems have very different characteristics from the high performance ones: they consume hundred times less power, they are based on a multi-processor architecture with lots of embedded memory and rely on cheap packaging solutions. In this paper, we investigate the need for temperature-aware design in a low-power systems-on-a-chip and provide guidlines to delimit the conditions for which temperature-aware design is needed. | |
| Data prodotto definitivo in UGOV: | 2-ott-2006 | |
| Appare nelle tipologie: | 4.01 Contributo in Atti di convegno |
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