This paper presents a thermal analysis methodology for modeling the junction-to-fluid thermal resistance of an automotive-grade SiC power module using computational fluid dynamics (CFD) simulations based on manufacturer datasheet data. The resulting thermal resistance map enables accurate electro-thermal simulations across a wide range of operating conditions and geometries, improving predictive capabilities in the design and optimization of electronic power systems.
Ferretti, J., Colombini, L., Nerone, M., Valic, I., Ferrarese, F., Schiapparelli, G.P., et al. (2025). Thermal Modeling of SiC Power Module: A CFD-Based Approach for Junction-to-Fluid Resistance Estimate. Mesago PCIM GmbH [10.30420/566541305].
Thermal Modeling of SiC Power Module: A CFD-Based Approach for Junction-to-Fluid Resistance Estimate
Ferretti J.
Primo
;Nerone M.;Valic I.;Tallarico A. N.Ultimo
Supervision
2025
Abstract
This paper presents a thermal analysis methodology for modeling the junction-to-fluid thermal resistance of an automotive-grade SiC power module using computational fluid dynamics (CFD) simulations based on manufacturer datasheet data. The resulting thermal resistance map enables accurate electro-thermal simulations across a wide range of operating conditions and geometries, improving predictive capabilities in the design and optimization of electronic power systems.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
