DAZZI, MARTINO
DAZZI, MARTINO
DIPARTIMENTO DI INGEGNERIA DELL'ENERGIA ELETTRICA E DELL'INFORMAZIONE "GUGLIELMO MARCONI"
A Fully Integrated 5-mW, 0.8-Gbps Energy-Efficient Chip-to-Chip Data Link for Ultralow-Power IoT End-Nodes in 65-nm CMOS
2021 Okuhara H.; Elnaqib A.; Dazzi M.; Palestri P.; Benatti S.; Benini L.; Rossi D.
Efficient Pipelined Execution of CNNs Based on In-Memory Computing and Graph Homomorphism Verification
2021 Dazzi M.; Sebastian A.; Parnell T.; Francese P.A.; Benini L.; Eleftheriou E.
Graphene-based Wireless Agile Interconnects for Massive Heterogeneous Multi-chip Processors
2023 Abadal S.; Guirado R.; Taghvaee H.; Jain A.; Santana E.P.D.; Bolivar P.H.; Saeed M.; Negra R.; Wang Z.; Wang K.; Lemme M.C.; Klein J.; Zapater M.; Levisse A.; Atienza D.; Rossi D.; Conti F.; Dazzi M.; Karunaratne G.; Boybat I.; Sebastian A.
Sub-mW multi-Gbps chip-to-chip communication Links for Ultra-Low Power IoT end-nodes
2018 Martino, Dazzi; Pierpaolo, Palestri; Davide, Rossi; Andrea, Bandizioly; Igor, Loi; David, Bellasi; Luca, Benini
| Titolo | Autore(i) | Anno | Periodico | Editore | Tipo | File |
|---|---|---|---|---|---|---|
| A Fully Integrated 5-mW, 0.8-Gbps Energy-Efficient Chip-to-Chip Data Link for Ultralow-Power IoT End-Nodes in 65-nm CMOS | Okuhara H.; Elnaqib A.; Dazzi M.; Palestri P.; Benatti S.; Benini L.; Rossi D. | 2021-01-01 | IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS | - | 1.01 Articolo in rivista | A_Fully_Integrated _5-mW _pprint.pdf |
| Efficient Pipelined Execution of CNNs Based on In-Memory Computing and Graph Homomorphism Verification | Dazzi M.; Sebastian A.; Parnell T.; Francese P.A.; Benini L.; Eleftheriou E. | 2021-01-01 | IEEE TRANSACTIONS ON COMPUTERS | - | 1.01 Articolo in rivista | - |
| Graphene-based Wireless Agile Interconnects for Massive Heterogeneous Multi-chip Processors | Abadal S.; Guirado R.; Taghvaee H.; Jain A.; Santana E.P.D.; Bolivar P.H.; Saeed M.; Negra R.; Wa...ng Z.; Wang K.; Lemme M.C.; Klein J.; Zapater M.; Levisse A.; Atienza D.; Rossi D.; Conti F.; Dazzi M.; Karunaratne G.; Boybat I.; Sebastian A. | 2023-01-01 | IEEE WIRELESS COMMUNICATIONS | - | 1.01 Articolo in rivista | - |
| Sub-mW multi-Gbps chip-to-chip communication Links for Ultra-Low Power IoT end-nodes | Martino, Dazzi; Pierpaolo, Palestri; Davide, Rossi; Andrea, Bandizioly; Igor, Loi; David, Bellasi...; Luca, Benini | 2018-01-01 | - | - | 4.01 Contributo in Atti di convegno | - |