This article investigates the evolution of electrical properties of polyethylene terephthalate (PET) with thermal aging. Electrical tests are performed within a wide range of frequencies in order to simulate the application conditions of insulating materials in inverter-fed machines. In particular, for the aging conditions considered, the real part of permittivity showed to be correlated with the concentration of the degradation species, investigated through FTIR. On the contrary, the dielectric breakdown at high frequencies showed to be independent from the corresponding values of the dissipation factor (tanδ). This behavior would imply that thermal runaway is not the principal phenomenon leading to the dielectric failure.

Villibor J., Zheng C., Bak C.L., Suraci S.V., Rumi A., Cavallini A. (2023). Breakdown at Medium Frequencies of Thermally-Aged Polyester Films. Institute of Electrical and Electronics Engineers Inc. [10.1109/EIC55835.2023.10177223].

Breakdown at Medium Frequencies of Thermally-Aged Polyester Films

Suraci S. V.;Rumi A.;Cavallini A.
2023

Abstract

This article investigates the evolution of electrical properties of polyethylene terephthalate (PET) with thermal aging. Electrical tests are performed within a wide range of frequencies in order to simulate the application conditions of insulating materials in inverter-fed machines. In particular, for the aging conditions considered, the real part of permittivity showed to be correlated with the concentration of the degradation species, investigated through FTIR. On the contrary, the dielectric breakdown at high frequencies showed to be independent from the corresponding values of the dissipation factor (tanδ). This behavior would imply that thermal runaway is not the principal phenomenon leading to the dielectric failure.
2023
2023 IEEE Electrical Insulation Conference, EIC 2023
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Villibor J., Zheng C., Bak C.L., Suraci S.V., Rumi A., Cavallini A. (2023). Breakdown at Medium Frequencies of Thermally-Aged Polyester Films. Institute of Electrical and Electronics Engineers Inc. [10.1109/EIC55835.2023.10177223].
Villibor J.; Zheng C.; Bak C.L.; Suraci S.V.; Rumi A.; Cavallini A.
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11585/939200
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