This paper presents the design and evaluation of a two-switch flyback power supply with ultra-wide input voltage range (230-1300 V), fed from the floating dc bus of power electronics building blocks (PEBB) in medium voltage (MV) modular multilevel converter (MMC) applications. Rated at 80 W, 48 V output, and operating at 50 kHz, the proposed converter uses 1.7 kV SiC devices and a planar PCB-winding transformer to achieve a low-profile form factor. Further, a pre-charge circuit and start-up sequence are developed as well, enabling the two-switch flyback converter to wake up at 230 V. Experimental results are presented for verification and evaluation purposes.

Rizzoli, G., Zarri, L., Wang, J., Shen, Z., Burgos, R., Boroyevich, D. (2016). Design of a two-switch flyback power supply using 1.7 kV SiC devices for ultra-wide input-voltage range applications. Institute of Electrical and Electronics Engineers Inc. [10.1109/ECCE.2016.7855028].

Design of a two-switch flyback power supply using 1.7 kV SiC devices for ultra-wide input-voltage range applications

RIZZOLI, GABRIELE;ZARRI, LUCA;
2016

Abstract

This paper presents the design and evaluation of a two-switch flyback power supply with ultra-wide input voltage range (230-1300 V), fed from the floating dc bus of power electronics building blocks (PEBB) in medium voltage (MV) modular multilevel converter (MMC) applications. Rated at 80 W, 48 V output, and operating at 50 kHz, the proposed converter uses 1.7 kV SiC devices and a planar PCB-winding transformer to achieve a low-profile form factor. Further, a pre-charge circuit and start-up sequence are developed as well, enabling the two-switch flyback converter to wake up at 230 V. Experimental results are presented for verification and evaluation purposes.
2016
ECCE 2016 - IEEE Energy Conversion Congress and Exposition, Proceedings
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5
Rizzoli, G., Zarri, L., Wang, J., Shen, Z., Burgos, R., Boroyevich, D. (2016). Design of a two-switch flyback power supply using 1.7 kV SiC devices for ultra-wide input-voltage range applications. Institute of Electrical and Electronics Engineers Inc. [10.1109/ECCE.2016.7855028].
Rizzoli, G.; Zarri, L.; Wang, J.; Shen, Z.; Burgos, R.; Boroyevich, D.
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11585/587403
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