This paper presents a hybrid process chain for efficiently machining hard silicon nitride. The process includes a laser treatment phase to weaken the material, followed by diamond grinding. Optimized laser parameters have been identified to control the generation of a network of cracks that weakens the volume of material to be ground. Comparison of data between traditional and hybrid process chain shows a reduction in grinding force of about thirty per cent in the latter case. A finite element model has been developed for the analysis of thermal stresses generated by laser exposure and the prediction of crack formation.
Fortunato, A., Guerrini, G., Melkote, S.N., Bruzzone, A.A.G. (2015). A laser assisted hybrid process chain for high removal rate machining of sintered silicon nitride. CIRP ANNALS, 64(1), 189-192 [10.1016/j.cirp.2015.04.033].
A laser assisted hybrid process chain for high removal rate machining of sintered silicon nitride
Fortunato, A.;Guerrini, G.;
2015
Abstract
This paper presents a hybrid process chain for efficiently machining hard silicon nitride. The process includes a laser treatment phase to weaken the material, followed by diamond grinding. Optimized laser parameters have been identified to control the generation of a network of cracks that weakens the volume of material to be ground. Comparison of data between traditional and hybrid process chain shows a reduction in grinding force of about thirty per cent in the latter case. A finite element model has been developed for the analysis of thermal stresses generated by laser exposure and the prediction of crack formation.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
