The almost daily increase in dissipated power per unit area of electronic components sets higher and higher demands on the performance of the heat sinks. These must not only be able to dissipate high heat fluxes, but must also keep costs to a minimum and exhibit a reliable behaviour. In this paper a novel, modular heat sink consisting of elements with wavy fin profile which can be pressed together to construct the component is presented. Its performance under steady-state conditions are assessed for the case of forced convection in terms of velocity distribution in the channels and global thermal resistance. Configurations with uniform and non-uniform heat flux are studied and some considerations are made as to the influence of the spacers between fan and heat sink proper.
Lorenzini M., Fabbri G., Salvigni S. (2007). Performance evaluation of a wavy-fin heat sink for power electronics. APPLIED THERMAL ENGINEERING, 27(5-6), 969-975 [10.1016/j.applthermaleng.2006.08.006].
Performance evaluation of a wavy-fin heat sink for power electronics
LORENZINI, MARCO;FABBRI, GIAMPIETRO;SALVIGNI, SANDRO
2007
Abstract
The almost daily increase in dissipated power per unit area of electronic components sets higher and higher demands on the performance of the heat sinks. These must not only be able to dissipate high heat fluxes, but must also keep costs to a minimum and exhibit a reliable behaviour. In this paper a novel, modular heat sink consisting of elements with wavy fin profile which can be pressed together to construct the component is presented. Its performance under steady-state conditions are assessed for the case of forced convection in terms of velocity distribution in the channels and global thermal resistance. Configurations with uniform and non-uniform heat flux are studied and some considerations are made as to the influence of the spacers between fan and heat sink proper.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
