Some high-effectiveness heat sinks of novel conception are proposed for the forced cooling of electronic devices.The heat sinks –eight models in total- can be easily machined at low production costs.The performance of the heatsinks under steady-state conditions is experimentally investigated, when these are heated by a source at uniform tem-perature. In particular, the temperature of the heat sink surface in contact with the devices to be cooled is measuredtogether with the temperature of the cooling air. Two configurations of the fan are tested, namely a blowing and asucking arrangement. The pressure drops for both cases are also measured for each heat sink. The thermal resistanceof the heat dissipators, together with their weight, is then calculated and compared to that of heat sinks commerciallyavailable, one of which has also been tested under the same experimental conditions. It is concluded that such newdesign is competitive with the devices currently available, as the production costs and weight are lower and perform-ances are either comparable or better.
An Innovative Design of Heat Sink for Microelectronics / Fabbri, Giampietro; Lorenzini, Marco; Salvigni, Sandro. - ELETTRONICO. - CDrom:(2004), pp. 1-6. (Intervento presentato al convegno 4th European Thermal Sciences Conference tenutosi a BIRMINGHAM nel june 2004).
An Innovative Design of Heat Sink for Microelectronics
FABBRI, GIAMPIETRO;LORENZINI, MARCO;SALVIGNI, SANDRO
2004
Abstract
Some high-effectiveness heat sinks of novel conception are proposed for the forced cooling of electronic devices.The heat sinks –eight models in total- can be easily machined at low production costs.The performance of the heatsinks under steady-state conditions is experimentally investigated, when these are heated by a source at uniform tem-perature. In particular, the temperature of the heat sink surface in contact with the devices to be cooled is measuredtogether with the temperature of the cooling air. Two configurations of the fan are tested, namely a blowing and asucking arrangement. The pressure drops for both cases are also measured for each heat sink. The thermal resistanceof the heat dissipators, together with their weight, is then calculated and compared to that of heat sinks commerciallyavailable, one of which has also been tested under the same experimental conditions. It is concluded that such newdesign is competitive with the devices currently available, as the production costs and weight are lower and perform-ances are either comparable or better.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
