ABSTRACT The assessment of structural damage location in composite honeycomb sandwich panels is here pursued by means of a complete experimental non-destructive approach on a pre-damaged sample. In the experiments proposed full field displacement maps were acquired by means of optical non-contact Electronic Speckle Pattern Interferometry (ESPI) technology [1, 2], in order to obtain high spatial definition and locate small defects on the sample, like debondings, material separations, voids, cracks and delaminations. When dealing with holographic/speckle interferometry it is important to find the stressing technique able to produce singularities in the state of the object surface. Four different loading approaches were taken to detect the flaws: acoustic, thermal, static and harmonic excitation. The displacement maps acquired depict with high accuracy the inhomo-ge-neous local behavior of the structure induced by the defects. Results are reported from the different loading approaches and discussed in detail.

Damage location assessment in a composite panel by means of electronic speckle pattern interferometry measurements / A. Zanarini. - ELETTRONICO. - (2005), pp. 1-8. (Intervento presentato al convegno ASME - IDETC/CIE 2005 International Design Engineering Technical Conferences & Computers and Information in Engineering Conference tenutosi a Long Beach, CA, USA nel 24-28 settembre 2005).

Damage location assessment in a composite panel by means of electronic speckle pattern interferometry measurements

ZANARINI, ALESSANDRO
2005

Abstract

ABSTRACT The assessment of structural damage location in composite honeycomb sandwich panels is here pursued by means of a complete experimental non-destructive approach on a pre-damaged sample. In the experiments proposed full field displacement maps were acquired by means of optical non-contact Electronic Speckle Pattern Interferometry (ESPI) technology [1, 2], in order to obtain high spatial definition and locate small defects on the sample, like debondings, material separations, voids, cracks and delaminations. When dealing with holographic/speckle interferometry it is important to find the stressing technique able to produce singularities in the state of the object surface. Four different loading approaches were taken to detect the flaws: acoustic, thermal, static and harmonic excitation. The displacement maps acquired depict with high accuracy the inhomo-ge-neous local behavior of the structure induced by the defects. Results are reported from the different loading approaches and discussed in detail.
2005
Proceeding of the ASME - IDETC/CIE 2005 International Design Engineering Technical Conferences & Computers and Information in Engineering Conference
1
8
Damage location assessment in a composite panel by means of electronic speckle pattern interferometry measurements / A. Zanarini. - ELETTRONICO. - (2005), pp. 1-8. (Intervento presentato al convegno ASME - IDETC/CIE 2005 International Design Engineering Technical Conferences & Computers and Information in Engineering Conference tenutosi a Long Beach, CA, USA nel 24-28 settembre 2005).
A. Zanarini
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11585/28472
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