In this paper the innovative theoretical approach to the enlargement law for HVDC cables previously developed by the authors is investigated in more detail, by evaluating the role played by the main quantities that appear in the enlargement law. Firstly, the paper studies the effect of the Weibull shape parameter and of conductor temperature on the reduction of breakdown voltage with cable length in the enlargement from test to power HVDC cables by considering quantities related to typical extruded compounds for DC applications, thereby demonstrating a major role played not only by Weibull shape parameter, but also by volume electrical resistivity of the insulation, hence by the different compounds. Secondly, the behaviour of the cumbersome function HDC appearing in the enlargement formula for HVDC cables is analyzed via the Monte Carlo method and approximate expressions for HDC are proposed that are useful for insulation coordination and design.

A deeper insight into the application of the enlargement law to HVDC cables

MAZZANTI, GIOVANNI
2011

Abstract

In this paper the innovative theoretical approach to the enlargement law for HVDC cables previously developed by the authors is investigated in more detail, by evaluating the role played by the main quantities that appear in the enlargement law. Firstly, the paper studies the effect of the Weibull shape parameter and of conductor temperature on the reduction of breakdown voltage with cable length in the enlargement from test to power HVDC cables by considering quantities related to typical extruded compounds for DC applications, thereby demonstrating a major role played not only by Weibull shape parameter, but also by volume electrical resistivity of the insulation, hence by the different compounds. Secondly, the behaviour of the cumbersome function HDC appearing in the enlargement formula for HVDC cables is analyzed via the Monte Carlo method and approximate expressions for HDC are proposed that are useful for insulation coordination and design.
Proceedings of the 2011 IEEE Conference on Electrical Insulation and Dielectric Phenomena (IEEE CEIDP 2011)
505
509
M. Marzinotto; G. Mazzanti
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Utilizza questo identificativo per citare o creare un link a questo documento: http://hdl.handle.net/11585/106903
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