Additive technologies provide notable advantages over conventional manufacturing methods. In the field of electronics, 3D additive printing is a transformative tool that offers significant benefits through high levels of automation, the creation of multilayer structures, and the utilization of a variety of materials. It also reduces the environmental impact by minimizing the use of chemicals and the production of waste. This paper presents an initial evaluation of PEDOT: PSS-based semiconductive ink for printing electronic devices using Drop-on-Demand 3D printing. Detailed analysis and characterization of the material properties were performed. The ink formulation and printing process were optimized to achieve a stable printed layer. Lastly, the electrical properties of the printed devices were measured, showcasing the potential of this approach in electronic manufacturing. The results show that the film sheet resistance after the deposition of 15 layers of ink is equal to 235 kΩ on common photographic paper.

Nardello, M., Pellegrin, I., Doglioni, M., Pancheri, L., Brunelli, D. (2025). Characterization of Semiconductive Films for 3D Printed Flexible Electronics. Cham, Switzerland : Springer Nature Switzerland [10.1007/978-3-031-84100-2_62].

Characterization of Semiconductive Films for 3D Printed Flexible Electronics

Brunelli D.
Supervision
2025

Abstract

Additive technologies provide notable advantages over conventional manufacturing methods. In the field of electronics, 3D additive printing is a transformative tool that offers significant benefits through high levels of automation, the creation of multilayer structures, and the utilization of a variety of materials. It also reduces the environmental impact by minimizing the use of chemicals and the production of waste. This paper presents an initial evaluation of PEDOT: PSS-based semiconductive ink for printing electronic devices using Drop-on-Demand 3D printing. Detailed analysis and characterization of the material properties were performed. The ink formulation and printing process were optimized to achieve a stable printed layer. Lastly, the electrical properties of the printed devices were measured, showcasing the potential of this approach in electronic manufacturing. The results show that the film sheet resistance after the deposition of 15 layers of ink is equal to 235 kΩ on common photographic paper.
2025
Lecture Notes in Electrical Engineering Applications in Electronics Pervading Industry, Environment and Society
523
530
Nardello, M., Pellegrin, I., Doglioni, M., Pancheri, L., Brunelli, D. (2025). Characterization of Semiconductive Films for 3D Printed Flexible Electronics. Cham, Switzerland : Springer Nature Switzerland [10.1007/978-3-031-84100-2_62].
Nardello, M.; Pellegrin, I.; Doglioni, M.; Pancheri, L.; Brunelli, D.
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11585/1042158
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