MILLESIMO, MAURIZIO
MILLESIMO, MAURIZIO
CENTRO RICERCA SISTEMI ELETTRONICI INGEGN.INF. E TELECOM."ERCOLE DE CASTRO"
Assegnisti
Analysis of RTN Induced by Forward Gate Stress in GaN HEMTs with a Schottky p-GaN Gate
2024 Millesimo M.; Fiegna C.; Bakeroot B.; Borga M.; Posthuma N.; Decoutere S.; Sangiorgi E.; Tallarico A.N.
GaN HEMT with p-Type Schottky Gate: A Case Study of TCAD Modeling of the Gate Leakage Current
2024 Ercolano F.; Tallarico A.N.; Millesimo M.; Gnani E.; Reggiani S.; Fiegna C.; Borga M.; Posthuma N.; Bakeroot B.
P-GaN Gate HEMTs: A Solution to Improve the High-Temperature Gate Lifetime
2024 Tallarico A.N.; Millesimo M.; Borga M.; Bakeroot B.; Posthuma N.; Cosnier T.; Decoutere S.; Sangiorgi E.; Fiegna C.
Role of the GaN-on-Si Epi-Stack on Δ RONCaused by Back-Gating Stress
2023 Millesimo M.; Borga M.; Valentini L.; Bakeroot B.; Posthuma N.; Vohra A.; Decoutere S.; Fiegna C.; Tallarico A.N.
Gate Reliability of p-GaN Power HEMTs Under Pulsed Stress Condition
2022 Millesimo M.; Bakeroot B.; Borga M.; Posthuma N.; Decoutere S.; Sangiorgi E.; Fiegna C.; Tallarico A.N.
TCAD Modeling of the Dynamic VTH Hysteresis Under Fast Sweeping Characterization in p-GaN Gate HEMTs
2022 Tallarico A.N.; Millesimo M.; Bakeroot B.; Borga M.; Posthuma N.; Decoutere S.; Sangiorgi E.; Fiegna C.
The Role of Frequency and Duty Cycle on the Gate Reliability of p-GaN HEMTs
2022 Millesimo M.; Borga M.; Bakeroot B.; Posthuma N.; Decoutere S.; Sangiorgi E.; Fiegna C.; Tallarico A.N.
High-Temperature Time-Dependent Gate Breakdown of p-GaN HEMTs
2021 Millesimo M.; Fiegna C.; Posthuma N.; Borga M.; Bakeroot B.; Decoutere S.; Tallarico A.N.
Impact of structural and process variations on the time-dependent off-state breakdown of p-gan power hemts
2021 Millesimo M.; Posthuma N.; Bakeroot B.; Borga M.; Decoutere S.; Tallarico A.N.
| Titolo | Autore(i) | Anno | Periodico | Editore | Tipo | File |
|---|---|---|---|---|---|---|
| Analysis of RTN Induced by Forward Gate Stress in GaN HEMTs with a Schottky p-GaN Gate | Millesimo M.; Fiegna C.; Bakeroot B.; Borga M.; Posthuma N.; Decoutere S.; Sangiorgi E.; Tallaric...o A.N. | 2024-01-01 | - | Institute of Electrical and Electronics Engineers Inc. | 4.01 Contributo in Atti di convegno | - |
| GaN HEMT with p-Type Schottky Gate: A Case Study of TCAD Modeling of the Gate Leakage Current | Ercolano F.; Tallarico A.N.; Millesimo M.; Gnani E.; Reggiani S.; Fiegna C.; Borga M.; Posthuma N....; Bakeroot B. | 2024-01-01 | - | Springer Science and Business Media Deutschland GmbH | 4.01 Contributo in Atti di convegno | - |
| P-GaN Gate HEMTs: A Solution to Improve the High-Temperature Gate Lifetime | Tallarico A.N.; Millesimo M.; Borga M.; Bakeroot B.; Posthuma N.; Cosnier T.; Decoutere S.; Sangi...orgi E.; Fiegna C. | 2024-01-01 | IEEE ELECTRON DEVICE LETTERS | - | 1.01 Articolo in rivista | P-GaN_Gate_HEMTs_A_Solution_to_Improve_the_High-Temperature_Gate_Lifetime.pdf |
| Role of the GaN-on-Si Epi-Stack on Δ RONCaused by Back-Gating Stress | Millesimo M.; Borga M.; Valentini L.; Bakeroot B.; Posthuma N.; Vohra A.; Decoutere S.; Fiegna C....; Tallarico A.N. | 2023-01-01 | IEEE TRANSACTIONS ON ELECTRON DEVICES | - | 1.01 Articolo in rivista | Role_of_the_GaN-on-Si_Epi-Stack_on_RON_Caused_by_Back-Gating_Stress (1).pdf |
| Gate Reliability of p-GaN Power HEMTs Under Pulsed Stress Condition | Millesimo M.; Bakeroot B.; Borga M.; Posthuma N.; Decoutere S.; Sangiorgi E.; Fiegna C.; Tallaric...o A.N. | 2022-01-01 | - | Institute of Electrical and Electronics Engineers Inc. | 4.01 Contributo in Atti di convegno | - |
| TCAD Modeling of the Dynamic VTH Hysteresis Under Fast Sweeping Characterization in p-GaN Gate HEMTs | Tallarico A.N.; Millesimo M.; Bakeroot B.; Borga M.; Posthuma N.; Decoutere S.; Sangiorgi E.; Fie...gna C. | 2022-01-01 | IEEE TRANSACTIONS ON ELECTRON DEVICES | - | 1.01 Articolo in rivista | Post_print_version.pdf |
| The Role of Frequency and Duty Cycle on the Gate Reliability of p-GaN HEMTs | Millesimo M.; Borga M.; Bakeroot B.; Posthuma N.; Decoutere S.; Sangiorgi E.; Fiegna C.; Tallaric...o A.N. | 2022-01-01 | IEEE ELECTRON DEVICE LETTERS | - | 1.01 Articolo in rivista | The_Role_of_Frequency_and_Duty_Cycle_on_the_Gate_Reliability_of_p-GaN_HEMTs.pdf; The_Role_of_Frequency_and_Duty_Cycle_on_the_Gate_Reliability_postprint.pdf |
| High-Temperature Time-Dependent Gate Breakdown of p-GaN HEMTs | Millesimo M.; Fiegna C.; Posthuma N.; Borga M.; Bakeroot B.; Decoutere S.; Tallarico A.N. | 2021-01-01 | IEEE TRANSACTIONS ON ELECTRON DEVICES | - | 1.01 Articolo in rivista | Final_Manuscript_merged.pdf |
| Impact of structural and process variations on the time-dependent off-state breakdown of p-gan power hemts | Millesimo M.; Posthuma N.; Bakeroot B.; Borga M.; Decoutere S.; Tallarico A.N. | 2021-01-01 | IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY | - | 1.01 Articolo in rivista | Post_print_version.pdf |