In deep submicron circuits, high temperatures have created critical issues in reliability, timing, performance, coolings costs and leakage power. Task migration techniques have been proposed to manage efficiently the thermal distribution in multi-processor systems but at the cost of important performance penalties. While traditional techniques have focused on reducing the average temperature of the chip, they have not considered the effect that temperature gradients have in system reliability. In this work, we explore the benefits of thermal-aware task migration techniques for embedded multi-processor systems. We show the implementation issues of task migration policies on next generation architectural template of distributed memory multicore systems and we discuss the programmer’s implications. Built on top of this programming model, we propose several policies that are able to reduce the average temperature of the chip and the thermal gradients with a negligible performance overhead. With our techniques, hot spots and temperature gradients are decreased up to 30% with respect to state-of-the-art thermal management approaches.

Adaptive Task Migration Policies for Thermal Control in MPSoCs

ACQUAVIVA, ANDREA;
2011

Abstract

In deep submicron circuits, high temperatures have created critical issues in reliability, timing, performance, coolings costs and leakage power. Task migration techniques have been proposed to manage efficiently the thermal distribution in multi-processor systems but at the cost of important performance penalties. While traditional techniques have focused on reducing the average temperature of the chip, they have not considered the effect that temperature gradients have in system reliability. In this work, we explore the benefits of thermal-aware task migration techniques for embedded multi-processor systems. We show the implementation issues of task migration policies on next generation architectural template of distributed memory multicore systems and we discuss the programmer’s implications. Built on top of this programming model, we propose several policies that are able to reduce the average temperature of the chip and the thermal gradients with a negligible performance overhead. With our techniques, hot spots and temperature gradients are decreased up to 30% with respect to state-of-the-art thermal management approaches.
2011
VLSI 2010 Annual Symposium
83
115
David Cuesta; Jose Ayala; Jose Hidalgo; David Atienza; ACQUAVIVA, ANDREA; MACII, Enrico
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11585/746121
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