In this work, a stamp-size footprint, low power, and light weight sensor node for impact detection and location on laminate composite and metallic structures is presented. This device passively exploits the guided waves originated by the impacts and is meant as a basic building block for smart structure sensor networks development. It draws power from a two-wire differential data-over-power (DoP) network communication interface, which is also used for half-duplex communication at 200 kbps with a gateway device and the other nodes in the network. Each node measures roughly 30mm×23mm, consumes less than 35mA, and weighs less than 5 g, making it attractive for aerospace systems where size, power and weight reduction are crucial. Elastic waves generated from impacts and propagating on the structure to be monitored are converted to electrical signals by an innovative, patent-pending, spiral shaped piezoelectric transducer. Signals are simultaneously acquired at 1 Msps on each channel and processed by an embedded STM32F3 low-voltage 32-bit mixed-signal MCU with DSP and FPU instructions. A 128 KiB SPI serial SRAM is used for data storage while program instructions are stored in the MCU embedded 256 KiB flash. A low-voltage, high-speed, half-duplex RS485 transceiver is used to interface the MCU to the bus through a filtering mesh of passive components. This mesh also connects to a low-dropout voltage regulator, allowing it to draw power from the DoP bus without interfering with data transmission. A separate gateway device is also presented: it is capable to simultaneously interface and feed the DoP bus by drawing power either from a common PC USB2.0 port or from an external power supply. A network counting up to 64 nodes on a single wire can be implemented and interfaced to a PC for real-time impact detection applications. This network can be extended to an arbitrary number of nodes by means of signal repeaters.

A stamp size, 40mA, 5 grams sensor node for impact detection and location / Testoni, Nicola; Luca De Marchi, ; Marzani, Alessandro. - STAMPA. - (2016), pp. 1-8. (Intervento presentato al convegno 8th European Workshop On Structural Health Monitoring (EWSHM 2016) tenutosi a Bilbao, Spain nel 5-8 July, 2016).

A stamp size, 40mA, 5 grams sensor node for impact detection and location

TESTONI, NICOLA;DE MARCHI, LUCA;MARZANI, ALESSANDRO
2016

Abstract

In this work, a stamp-size footprint, low power, and light weight sensor node for impact detection and location on laminate composite and metallic structures is presented. This device passively exploits the guided waves originated by the impacts and is meant as a basic building block for smart structure sensor networks development. It draws power from a two-wire differential data-over-power (DoP) network communication interface, which is also used for half-duplex communication at 200 kbps with a gateway device and the other nodes in the network. Each node measures roughly 30mm×23mm, consumes less than 35mA, and weighs less than 5 g, making it attractive for aerospace systems where size, power and weight reduction are crucial. Elastic waves generated from impacts and propagating on the structure to be monitored are converted to electrical signals by an innovative, patent-pending, spiral shaped piezoelectric transducer. Signals are simultaneously acquired at 1 Msps on each channel and processed by an embedded STM32F3 low-voltage 32-bit mixed-signal MCU with DSP and FPU instructions. A 128 KiB SPI serial SRAM is used for data storage while program instructions are stored in the MCU embedded 256 KiB flash. A low-voltage, high-speed, half-duplex RS485 transceiver is used to interface the MCU to the bus through a filtering mesh of passive components. This mesh also connects to a low-dropout voltage regulator, allowing it to draw power from the DoP bus without interfering with data transmission. A separate gateway device is also presented: it is capable to simultaneously interface and feed the DoP bus by drawing power either from a common PC USB2.0 port or from an external power supply. A network counting up to 64 nodes on a single wire can be implemented and interfaced to a PC for real-time impact detection applications. This network can be extended to an arbitrary number of nodes by means of signal repeaters.
2016
Proceedings of the 8th European Workshop On Structural Health Monitoring (EWSHM 2016)
1
8
A stamp size, 40mA, 5 grams sensor node for impact detection and location / Testoni, Nicola; Luca De Marchi, ; Marzani, Alessandro. - STAMPA. - (2016), pp. 1-8. (Intervento presentato al convegno 8th European Workshop On Structural Health Monitoring (EWSHM 2016) tenutosi a Bilbao, Spain nel 5-8 July, 2016).
Testoni, Nicola; Luca De Marchi, ; Marzani, Alessandro
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11585/566189
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