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NOTA: è possibile cercare una corrispondenza esatta usando i doppi apici, ad es: "evoluzione della specie". Qualora si cerchi un identificativo, è consigliabile cercarlo in due modi differenti: tra apici con caratteri speciali es: "978-94-6366-274" oppure senza caratteri speciali solo come sequenza numerica: es 978946366274.
Risultati 1 - 10 di 790 (tempo di esecuzione: 0.11 secondi).
0, 1, 2, many - A classroom occupancy monitoring system for smart public buildings
2014 Paci, Francesco; Brunelli, Davide; Benini, Luca
16 Gb/s Microring-to-Microring Photonic Link in 45 nm Monolithic Zero-Change CMOS
2018 Marco Eppenberger; Arne Josten; Juerg Leuthold; Benedikt Bäuerle; Luca Alloatti; Luca Benini; David Moor
193 MOPS/mW @ 162 MOPS, 0.32V to 1.15V voltage range multi-core accelerator for energy efficient parallel and sequential digital processing
2016 Rossi, Davide; Pullini, Antonio; Loi, Igor; Gautschi, Michael; Gurkaynak, Frank Kagan; Teman, Adam; Constantin, Jeremy; Burg, Andreas; Miro-Panades, Ivan; Beign, Edith; Clermidy, Fabien; Abouzeid, Fady; Flatresse, Philippe; Benini, Luca
22.1 A 12.4TOPS/W @ 136GOPS AI-IoT System-on-Chip with 16 RISC-V, 2-to-8b Precision-Scalable DNN Acceleration and 30%-Boost Adaptive Body Biasing
2023 Conti, Francesco; Rossi, Davide; Paulin, Gianna; Garofalo, Angelo; Di Mauro, Alfio; Rutishauer, Georg; Ottavi, Gian marco; Eggimann, Manuel; Okuhara, Hayate; Huard, Vincent; Montfort, Olivier; Jure, Lionel; Exibard, Nils; Gouedo, Pascal; Louvat, Mathieu; Botte, Emmanuel; Benini, Luca
3D logarithmic interconnect: Stacking multiple L1 memory dies over multi-core clusters2013 Seventh IEEE/ACM International Symposium on Networks-on-Chip (NoCS)
2013 Erfan Azarkhish;Igor Loi;Luca Benini
3D NoCs — Unifying inter & intra chip communication
2010 Loi I. ; Marchal P. ; Pullini A. ; Benini L.
3D-LIN: A Configurable Low-Latency Interconnect for Multi-Core Clusters with 3D Stacked L1 Memory
2012 G. Beanato; I. Loi; G. De Micheli; Y. Leblebici; L. Benini
3dID: a low-power, low-cost hand motion capture device
2006 M. Sama; V. Pacella; E. Farella; L. Benini; B. Riccó
4.4 A 1.3TOPS/W @ 32GOPS Fully Integrated 10-Core SoC for IoT End-Nodes with 1.7μW Cognitive Wake-Up from MRAM-Based State-Retentive Sleep Mode
2021 Rossi D.; Conti F.; Eggiman M.; Mach S.; Mauro A.D.; Guermandi M.; Tagliavini G.; Pullini A.; Loi I.; Chen J.; Flamand E.; Benini L.
4.6 A 65nm CMOS 6.4-to-29.2pJ/FLOP@0.8V shared logarithmic floating point unit for acceleration of nonlinear function kernels in a tightly coupled processor cluster
2016 Gautschi, Michael; Schaffner, Michael; Gurkaynak, Frank K.; Benini, Luca
| Titolo | Autore(i) | Anno | Periodico | Editore | Tipo | File |
|---|---|---|---|---|---|---|
| 0, 1, 2, many - A classroom occupancy monitoring system for smart public buildings | Paci, Francesco; Brunelli, Davide; Benini, Luca | 2014-01-01 | - | - | 4.01 Contributo in Atti di convegno | - |
| 16 Gb/s Microring-to-Microring Photonic Link in 45 nm Monolithic Zero-Change CMOS | Marco Eppenberger; Arne Josten; Juerg Leuthold; Benedikt Bäuerle; Luca Alloatti; Luca Benini; Dav...id Moor | 2018-01-01 | - | - | 4.01 Contributo in Atti di convegno | - |
| 193 MOPS/mW @ 162 MOPS, 0.32V to 1.15V voltage range multi-core accelerator for energy efficient parallel and sequential digital processing | Rossi, Davide; Pullini, Antonio; Loi, Igor; Gautschi, Michael; Gurkaynak, Frank Kagan; Teman, Ada...m; Constantin, Jeremy; Burg, Andreas; Miro-Panades, Ivan; Beign, Edith; Clermidy, Fabien; Abouzeid, Fady; Flatresse, Philippe; Benini, Luca | 2016-01-01 | - | Institute of Electrical and Electronics Engineers Inc. | 4.01 Contributo in Atti di convegno | - |
| 22.1 A 12.4TOPS/W @ 136GOPS AI-IoT System-on-Chip with 16 RISC-V, 2-to-8b Precision-Scalable DNN Acceleration and 30%-Boost Adaptive Body Biasing | Conti, Francesco; Rossi, Davide; Paulin, Gianna; Garofalo, Angelo; Di Mauro, Alfio; Rutishauer, G...eorg; Ottavi, Gian marco; Eggimann, Manuel; Okuhara, Hayate; Huard, Vincent; Montfort, Olivier; Jure, Lionel; Exibard, Nils; Gouedo, Pascal; Louvat, Mathieu; Botte, Emmanuel; Benini, Luca | 2023-01-01 | - | - | 4.01 Contributo in Atti di convegno | - |
| 3D logarithmic interconnect: Stacking multiple L1 memory dies over multi-core clusters2013 Seventh IEEE/ACM International Symposium on Networks-on-Chip (NoCS) | Erfan Azarkhish;Igor Loi;Luca Benini | 2013-01-01 | - | IEEE | 4.01 Contributo in Atti di convegno | - |
| 3D NoCs — Unifying inter & intra chip communication | Loi I. ; Marchal P. ; Pullini A. ; Benini L. | 2010-01-01 | - | IEEE Press | 4.01 Contributo in Atti di convegno | - |
| 3D-LIN: A Configurable Low-Latency Interconnect for Multi-Core Clusters with 3D Stacked L1 Memory | G. Beanato; I. Loi; G. De Micheli; Y. Leblebici; L. Benini | 2012-01-01 | - | IEEE Press | 4.01 Contributo in Atti di convegno | - |
| 3dID: a low-power, low-cost hand motion capture device | M. Sama; V. Pacella; E. Farella; L. Benini; B. Riccó | 2006-01-01 | - | European Design and Automation Association | 4.01 Contributo in Atti di convegno | - |
| 4.4 A 1.3TOPS/W @ 32GOPS Fully Integrated 10-Core SoC for IoT End-Nodes with 1.7μW Cognitive Wake-Up from MRAM-Based State-Retentive Sleep Mode | Rossi D.; Conti F.; Eggiman M.; Mach S.; Mauro A.D.; Guermandi M.; Tagliavini G.; Pullini A.; Loi... I.; Chen J.; Flamand E.; Benini L. | 2021-01-01 | - | Institute of Electrical and Electronics Engineers Inc. | 4.01 Contributo in Atti di convegno | 09365939.pdf; paper_proofread_d.pdf |
| 4.6 A 65nm CMOS 6.4-to-29.2pJ/FLOP@0.8V shared logarithmic floating point unit for acceleration of nonlinear function kernels in a tightly coupled processor cluster | Gautschi, Michael; Schaffner, Michael; Gurkaynak, Frank K.; Benini, Luca | 2016-01-01 | DIGEST OF TECHNICAL PAPERS - IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE | Institute of Electrical and Electronics Engineers Inc. | 4.01 Contributo in Atti di convegno | - |
Risultati 1 - 10 di 790 (tempo di esecuzione: 0.11 secondi).
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Opzioni
Scopri
Tipologia
- 4 - Contributo in Atti di convegno 790
- 4 - Contributo in Atti di convegn... 790
Data di pubblicazione
- 2020 - 2023 211
- 2010 - 2019 401
- 2004 - 2009 178
Editore
- Institute of Electrical and Elect... 203
- IEEE Press 84
- s.n 78
- IEEE 74
- ACM 33
- IEEE Computer Society 24
- Association for Computing Machine... 21
- Springer 19
- 2013 IEEE Conference Proceedings 18
- Association for Computing Machinery 17
Rivista
- PROCEEDINGS - DESIGN, AUTOMATION,... 9
- IEEE INTERNATIONAL SYMPOSIUM ON C... 5
- LECTURE NOTES IN COMPUTER SCIENCE 3
- DIGEST OF TECHNICAL PAPERS - IEEE... 2
- IEEE COMPUTER SOCIETY CONFERENCE ... 2
- IEEE INTERNATIONAL ULTRASONICS SY... 2
- PROCEEDINGS OF SPIE, THE INTERNAT... 2
- CEUR WORKSHOP PROCEEDINGS 1
- DIGEST OF TECHNICAL PAPER 1
- FRONTIERS IN ARTIFICIAL INTELLIGE... 1
Serie
- PROCEEDINGS - DESIGN, AUTOMATION,... 17
- LECTURE NOTES IN COMPUTER SCIENCE 13
- DIGEST OF TECHNICAL PAPERS - IEEE... 5
- LECTURE NOTES IN ARTIFICIAL INTEL... 5
- PROCEEDINGS OF IEEE SENSORS ... 5
- IEEE ENGINEERING IN MEDICINE AND ... 4
- IEEE INTERNATIONAL ULTRASONICS SY... 4
- CONFERENCE PROCEEDINGS - IEEE INS... 3
- LECTURE NOTES IN ELECTRICAL ENGIN... 3
- PROCEEDINGS DESIGN, AUTOMATION, A... 3
Keyword
- Electrical and Electronic Enginee... 66
- Hardware and Architecture 52
- Computer Networks and Communications 33
- Software 26
- RISC-V 23
- Computer Science Applications1707... 20
- Instrumentation 16
- Computer architecture 15
- Computer Science (all) 15
- Energy Efficiency 14
Lingua
- eng 787
- ita 2
- spa 1
Accesso al fulltext
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- open 79
- partially open 11
- embargoed 5