The power density inside high performance systems continues to rise with every process technology generation, thereby increasing the operating temperature and creating "hot spots" on the die. As a result, the performance, reliability and power consumption of the system degrade. To avoid these "hot spots", "temperature-aware" design has become a must. For low-power embedded systems though, it is not clear whether similar thermal problems occur. These systems have very different characteristics from the high performance ones: they consume hundred times less power, they are based on a multi-processor architecture with lots of embedded memory and rely on cheap packaging solutions. In this paper, we investigate the need for temperature-aware design in a low-power systems-on-a-chip and provide guidlines to delimit the conditions for which temperature-aware design is needed.
Exploring "temperature-aware" design in low-power MPSoCs
PACI, GIACOMO;POLETTI, FRANCESCO;BENINI, LUCA
2006
Abstract
The power density inside high performance systems continues to rise with every process technology generation, thereby increasing the operating temperature and creating "hot spots" on the die. As a result, the performance, reliability and power consumption of the system degrade. To avoid these "hot spots", "temperature-aware" design has become a must. For low-power embedded systems though, it is not clear whether similar thermal problems occur. These systems have very different characteristics from the high performance ones: they consume hundred times less power, they are based on a multi-processor architecture with lots of embedded memory and rely on cheap packaging solutions. In this paper, we investigate the need for temperature-aware design in a low-power systems-on-a-chip and provide guidlines to delimit the conditions for which temperature-aware design is needed.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
