Non-contact probing can provide an important contribution for testing complex Systems-on-a-Chip (SoC), Systems-in-a-Package (SiP) and Through-Silicon-Vias (TSV) interconnections. This paper demonstrates the feasibility of wireless testing by capacitive coupling between a cantilever probe card and a pad. In particular a scheme of an I/O pad suitable for both contact and contactless probing is proposed.
Input/Output pad for direct contact and contactless testing / M.Scandiuzzo; S. Cani; L.Perugini; S. Spolzino; R. Canegallo; L.Perilli; R. Cardu; E. Franchi Scarselli; C. Gozzi; F. Maggioni. - ELETTRONICO. - (2011), pp. 135-140. (Intervento presentato al convegno IEEE European Test Symposium tenutosi a Trondheim, Norway nel 23-27 Maggio 2011) [10.1109/ETS.2011.24].
Input/Output pad for direct contact and contactless testing
PERUGINI, LUCA;PERILLI, LUCA;FRANCHI SCARSELLI, ELEONORA;
2011
Abstract
Non-contact probing can provide an important contribution for testing complex Systems-on-a-Chip (SoC), Systems-in-a-Package (SiP) and Through-Silicon-Vias (TSV) interconnections. This paper demonstrates the feasibility of wireless testing by capacitive coupling between a cantilever probe card and a pad. In particular a scheme of an I/O pad suitable for both contact and contactless probing is proposed.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
