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Titolo Autore(i) Anno Periodico Editore Tipo File
Numerical investigation of the lateral and vertical leakage currents and breakdown regimes in GaN-on-Silicon vertical structures Cornigli, Davide; Reggiani, Susanna; Gnani, Elena; Gnudi, Antonio; Baccarani, Giorgio; Moens, Pet...er; Vanmeerbeek, Piet; Banerjee, Abhishek; Meneghesso, Gaudenzio 2015-01-01 - Institute of Electrical and Electronics Engineers Inc. 4.01 Contributo in Atti di convegno -
Leakage current and breakdown of GaN-on-Silicon vertical structures Cornigli, D.; Monti, F.; Reggiani, S.; Gnani, E.; Gnudi, A.; Baccarani, G. 2015-01-01 - Institute of Electrical and Electronics Engineers Inc. 4.01 Contributo in Atti di convegno -
TCAD analysis of the leakage current and breakdown versus temperature of GaN-on-Silicon vertical structures Cornigli, Davide; Monti, Federico; Reggiani, Susanna; Gnani, Elena; Gnudi, Antonio; Baccarani, Gi...orgio 2016-01-01 SOLID-STATE ELECTRONICS - 1.01 Articolo in rivista -
Characterization of dielectric properties and conductivity in encapsulation materials with high insulating filler contents Cornigli, Davide*; Reggiani, Susanna; Gnudi, Antonio; Gnani, Elena; Baccarani, Giorgio; Fabiani, ...Davide; Varghese, Dhanoop; Tuncer, Enis; Krishnan, Srikanth; Nguyen, Luu 2018-01-01 IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION - 1.01 Articolo in rivista Characterization of dielectric properties_accepted_manuscript.pdf
Electrical characterization of epoxy-based molding compounds for next generation HV ICs in presence of moisture Cornigli, D.*; Reggiani, S.; Gnudi, A.; Gnani, E.; Baccarani, G.; Fabiani, D.; Varghese, D.; Tunc...er, E.; Krishnan, S.; Nguyen, L. 2018-01-01 MICROELECTRONICS RELIABILITY - 1.01 Articolo in rivista Microele_reliability_final_accepted1.pdf
Characterization and Modeling of BTI in SiC MOSFETs Cornigli D.; Tallarico A.N.; Reggiani S.; Fiegna C.; Sangiorgi E.; Sanchez L.; Valdivieso C.; Con...sentino G.; Crupi F. 2019-01-01 - Editions Frontieres 4.01 Contributo in Atti di convegno 08901761 (1).pdfcombinepdfESSDERC2019.pdf
Effects of Filler Configuration and Moisture on Dissipation Factor and Critical Electric Field of Epoxy Composites for HV-ICs Encapsulation Ahn W.; Cornigli D.; Varghese D.; Nguyen L.; Krishnan S.; Reggiani S.; Alam M.A. 2020-01-01 IEEE TRANSACTIONS ON COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY - 1.01 Articolo in rivista -
Space Charge Redistribution in Epoxy Mold Compounds of High-Voltage ICs at Dry and Wet Conditions: Theory and Experiment Ahn W.; Alam M.A.; Cornigli D.; Reggiani S.; Varghese D.; Krishnan S. 2021-01-01 IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION - 1.01 Articolo in rivista -
Mostrati risultati da 1 a 8 di 8
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